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Ultraviolet LED packaging structure

A technology of LED packaging and LED chips, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as poor reliability, achieve the effects of reducing irradiation, reducing comprehensive stress, and preventing metal atom migration

Active Publication Date: 2020-05-05
XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims to provide an ultraviolet LED packaging structure to solve the problem of poor reliability of the existing ultraviolet LED packaging structure

Method used

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Examples

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Embodiment 1

[0038] like image 3 As shown, this embodiment provides an ultraviolet LED packaging structure, which includes an ultraviolet LED chip 10 in a flip-chip structure, a packaging substrate 20 and an encapsulating adhesive 40 covering the ultraviolet LED chip 10 . The wavelength of the LED chip 10 can be between 200-380nm, and the light-emitting wavelength can be selected according to the needs of practical applications, such as surface sterilization and surface curing. Preferably, the LED chip 10 is 200-340nm.

[0039] Wherein, the ultraviolet LED chip 10 is a flip-chip structure, and there are two chip electrodes 100 as positive and negative electrodes on the bottom surface away from the light-emitting surface. The packaging substrate 20 can be ceramic materials such as aluminum nitride and aluminum oxide, preferably aluminum nitride ceramic materials with a larger thermal conductivity. The packaging substrate 20 has at least two substrate electrodes 200 matched with the chip e...

Embodiment 2

[0051] like Figure 7 and Figure 8 As shown, this embodiment also provides an ultraviolet LED packaging structure, which is roughly the same as the ultraviolet LED packaging structure in Embodiment 1, the difference is that the packaging glue of the ultraviolet LED packaging structure in this embodiment The packaging methods of the material 40 are different.

[0052] The packaging adhesive 40 of the ultraviolet LED packaging structure in this embodiment is completely coated on the surface of the package along the surface of the chip and the surface of the ceramic substrate by vacuum filming. Since the surface of the ceramic substrate in contact with the fluororesin itself has metal bumps, And inherent LED chips or other components, the surface is uneven, so the packaging structure after vacuum coating forms a concave-convex curved surface structure. The thickness of the fluororesin film of this structure should be smaller than that of the LED chip, preferably, the film thic...

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Abstract

The invention relates to an ultraviolet LED packaging structure. The ultraviolet LED packaging structure comprises an ultraviolet LED chip of an inverted structure, a packaging substrate with at leasttwo substrate electrodes and a packaging adhesive material covering the ultraviolet LED chip. Positive and negative chip electrodes of the ultraviolet LED chip are respectively conducted with the twosubstrate electrodes. An insulation gap is formed between the positive chip electrode, the negative chip electrode and the two substrate electrodes. The insulation gap is filled with a shielding object, and the shielding object is a fluororesin material containing part of crystal substances. The problem that an existing ultraviolet LED packaging structure is poor in reliability is solved.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to an ultraviolet LED packaging structure. Background technique [0002] Most of the existing ultraviolet LED packaging adopts flip-chip LED chips, and the common packaging structure is glass packaging with high ultraviolet transmittance, or resin material packaging that is resistant to ultraviolet radiation. glass package (such as figure 1 Shown) is to fix the UV LED chip 10' of the flip-chip structure in the bowl cup of the package substrate 20' by means of solder paste or eutectic soldering, and make the chip electrode 100' of the UV LED chip 10' and the bowl cup The inner substrate electrode 200' is bonded and fixed, and then a quartz glass plate 30' is fixed at the opening of the bowl, so that a closed chamber is formed inside the bowl. [0003] Resin material encapsulation (such as figure 2 shown) is to solidify the UV LED chip 10' on the packaging substrate 20' by means of so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/56H01L33/62
CPCH01L33/48H01L33/62H01L33/52H01L33/56
Inventor 黄森鹏陈顺意黄永特余长治徐宸科
Owner XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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