Deplating solution for removing nickel layer on copper surface and deplating process thereof

Abstract

The invention discloses a deplating solution for removing a nickel layer on a copper surface. The deplating solution is obtained by uniformly mixing the following raw materials in parts by weight: 15-35 parts of sodium bromide, 6-10 parts of an oxidant, 5-10 parts of tartaric acid, 0.5-1 part of urea, 0.2-0.5 part of benzotriazole, 0.1-0.3 part of cobalt acetate and 40-60 parts of water, wherein the oxidant is a mixture of a 30wt% hydrogen peroxide aqueous solution, manganese dioxide and sodium perbromate according to a mass ratio of (10-20): (3-5): 1. The deplating solution is high in nickellayer deplating efficiency, cannot corrode a copper matrix, and has important practical application value.

Description

technical field [0001] The invention belongs to the field of metal surface treatment, and in particular relates to a deplating solution for removing a nickel layer on a copper surface and a deplating process thereof. Background technique [0002] In the modern electroplating process, it is often necessary to plate a nickel layer on the copper layer, so as to play the role of anti-corrosion, anti-rust and transitional coating of other metals. However, the electroplating process often has many processes, the untimely maintenance of the plating solution or the change of the electroplating process parameters directly lead to frequent quality problems of the nickel layer during the nickel plating process of the copper layer, and it is necessary to strip and re-plate nickel. However, existing stripping solutions often also strip or over-corrode the copper layer, resulting in scrapped products. Existing techniques for stripping nickel on the copper layer mainly include electrolysi...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of deplating solution that does not cause corrosion to the copper substrate and has high deplating efficiency to the nickel layer, mainly to solve the problem that the deplating solution has a slight effect on the copper layer in the prior art. Problems of low corrosion and deplating efficiency

Images