Production device for diamond wire-saw wire through electrospark deposition

Abstract

The invention provides a production device for a diamond wire-saw wire through electrospark deposition. The production device comprises a liquid supplying device, an electrospark deposition device anda pulsed power supply; and the electrospark deposition device is used for conducting liquid spraying deposition on a wire-saw wire substrate, the pulsed power supply is used for supplying power to the electrospark deposition device, the electrospark deposition device is connected with the liquid supplying device, the pulsed power supply is connected with the electrospark deposition device, the electrospark deposition device is arranged on a rotating device, the rotating device is provided with a horizontal moving device used for pushing the electrospark deposition device to move, and the rotating device is further provided with a swinging device for driving the electrospark deposition device to swing. According to the production device, electrospark deposition solidification of diamond abrasive particles can be achieved on the set position of the wire-saw wire substrate, and the diamond wire-saw wire with orderly arranged abrasive particles is manufactured.

Description

technical field [0001] The invention relates to the field of wire saw wire production with consolidated abrasive grains, in particular to a production device that uses an electric spark deposition process to consolidate abrasive grains such as diamond on a wire saw wire substrate. Background technique [0002] Consolidated abrasive wire saw wire is a kind of wire saw wire made by using diamonds as abrasive grains and consolidating the abrasive grains on the wire saw wire substrate. Due to its high slice quality, high cutting efficiency, narrow kerf and environmental pollution It has a broad application prospect in the field of crystal sawing. [0003] At present, the abrasive grains of the consolidated abrasive wire saw wire are mainly fixed by resin bond and electroplating. The resin bond is used for bonding, and the holding force of the abrasive grain is low, and the sawing ability is poor, which affects the use of the wire saw wire. Scope: The electroplating method is ad...

AI Technical Summary

Problems solved by technology

[0003] At present, the abrasive grains of the consolidated abrasive wire saw wire are mainly fixed by resin bond and electroplating. The resin bond is used for bonding, and the holding force of the abrasive grain is low, and the sawing ability is poor, which affects the use of the wire saw wire. Scope: The electroplating method is adopted. At present, the suspension sanding process is mostly used, that is, the wire saw wire matrix is ​​placed in the medium liquid for electroplating, and the abrasive grains are consolidated on the wire saw wire matrix by electroplating. The abrasive grains are held better than resin bonding. , but the production process is complicated, the equipment is expensive, and the volatilization and emission of the plating solution have an impact on the environment

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