Material tray degumming and arranging process

A material tray and degumming technology, which is applied to chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., can solve the problems of inability to realize automatic degumming, low production efficiency, and high work difficulty, and achieve favorable Promote the use, improve production efficiency, and save labor costs

Inactive Publication Date: 2020-04-17
东莞市日和自动化设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, automatic degumming and plate placement cannot be realized during the production process, which is time-consuming and labor-intensive, with low production efficiency and high work difficulty

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] A tray degumming and swinging process, comprising the steps of:

[0024] Step 1, place the tray into the trough for soaking and degumming;

[0025] Step 2, after completing one soaking, put it into another trough for second soaking and degumming;

[0026] Step 3, taking the material from the tray and drying it;

[0027] Step 4, after the drying is completed, grab the tray and place it on the adsorption platform;

[0028] Step 5, the adsorption platform absorbs the wafer on the tray through vacuum negative pressure;

[0029] Step 6, grab and place the wafer on the adsorption platform to the jig to complete the degumming and arranging.

[0030] In step 1, the material tray is automatically taken out and placed in the trough for one soaking. There are several sets of troughs for one soaking that can soak multiple trays at the same time. Due to the long soaking time, multiple sets of trays can be placed in sequence Soaking is carried out to improve the degumming efficie...

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PUM

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Abstract

The invention relates to the technical field of wafer degumming, in particular to a material tray degumming and arranging process. The process comprises the following steps: step 1, placing a materialtray into a material tank for primary soaking degumming; step 2, after finishing primary soaking, placing into another material tank for secondary soaking degumming; step 3, drying materials taken from the material tray; step 4, after drying, grabbing and overturning the material tray and placing the material tray on an adsorption platform; step 5, adsorbing wafers on the material tray through vacuum negative pressure by an adsorbing platform; and step 6, grabbing and placing the wafers on the adsorption platform to a jig to finish degumming and arranging. According to the process, a double-soaking structure is adopted, so that the glue on the silicon wafers falls off more thoroughly, the wafers can be separated through vacuum adsorption after being dried, and the production efficiency can be greatly improved; and meanwhile, the automatic material taking and arranging process is adopted, and labor cost is saved.

Description

technical field [0001] The invention relates to the technical field of wafer degumming, in particular to a tray degumming and swinging process. Background technique [0002] Silicon wafers are cut by sticking silicon rods on the crystal holder with colloid. The cut silicon wafers need to be degummed. The conventional degumming process has imperfect degumming, and the residual glue will cause the silicon wafer to be scrapped or degummed. At this time, the time from the first silicon wafer to the last silicon wafer is too long, and the first debonded one cannot be taken out during the degumming process, which will lead to the oxidation reaction of the first detached silicon wafer, so that the first detached silicon wafer will be oxidized. Silicon wafers are scrapped. [0003] In the prior art, the trough immersion method is adopted in the degumming of silicon wafers. For example, the Chinese patent publication number is CN105855213A, which discloses a silicon wafer degumming ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/08B08B13/00
CPCB08B3/08B08B13/00
Inventor 张威
Owner 东莞市日和自动化设备有限公司
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