Packaging adhesive film for photovoltaic module

A technology for encapsulating adhesive films and photovoltaic modules, applied in adhesives, film/sheet adhesives, adhesive additives, etc., can solve problems such as high cost, easy precipitation of additives, delamination, etc.

Pending Publication Date: 2020-04-07
SHANGHAI HIUV NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to its structural limitations, POE has high cost, small friction coefficient, slow crosslinking rate, and prone to thermal creep, resulting in increased component cost, reduced production capacity, and reduced production yield.
In addition, due to the poor compatibility of POE with most polar ad

Method used

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  • Packaging adhesive film for photovoltaic module
  • Packaging adhesive film for photovoltaic module
  • Packaging adhesive film for photovoltaic module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] This embodiment provides as figure 2 The structure of the film, the film structure is three layers, including the outer layer 1, the inner layer 2, the middle layer 3, the inner and outer layers are EVA resin, the middle layer is POE resin. The overall thickness of the adhesive film is 500 microns, the thickness of the middle layer is 250 microns, and the thickness of the inner and outer layers of EVA is 125 microns. The melt flow rate of the POE resin is 15 g / min, the melt flow rate of the EVA resin is 5 g / min, and the VA content is 28%. 0.9 parts by mass of ethoxylated pentaerythritol triacrylate was added to each layer.

Embodiment 2

[0021] The adhesive film provided by this embodiment is basically the same as the adhesive film in Example 1, except that the melt flow rate of the inner and outer layers of EVA resin is 2g / min, the VA content is 26%, and the melt flow rate of the middle layer POE resin The rate was 5 g / min. 2.1 parts by mass of propoxylated neopentyl glycol diacrylate was added to each layer.

Embodiment 3

[0023] The adhesive film provided by this embodiment is basically the same as the adhesive film in Example 1, except that the melt flow rate of the inner and outer layers of EVA resin is 16g / min, the VA content is 32%, and the melt flow rate of the middle layer POE resin The rate was 25 g / min. 1.1 parts by mass of ethoxylated trimethylolpropane triacrylate was added to each layer.

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Abstract

The invention discloses a packaging adhesive film for a photovoltaic module. The packaging adhesive film comprises an outer layer which is in contact with glass or a back plate and has high bonding reliability, an inner layer which has a low stress effect on a battery piece, and a middle layer which has a high PID resistance effect. The overall thickness of the adhesive film is 200-1000 microns; the thickness of the middle layer is in a range of 160-750 microns, and the specific value of the thickness of the middle layer is related to the overall thickness of the film; the inner layer and theouter layer of the adhesive film are both made of EVA resin with a melt flow rate of 2-16 g/min and a VA content of 26%-32%; the middle layer is made of POE resin with a melt flow rate of 5-25 g/min;and the middle layer, the inner layer and the outer layer are all added with an anti-PID aid which is acrylate containing ethyoxyl or propoxyl groups, and the addition amount of the aid in each layerranges from 0.3% to 2.1%.

Description

technical field [0001] The invention relates to a packaging adhesive film for photovoltaic modules, in particular to a multi-layer co-extrusion packaging adhesive film capable of improving the anti-PID performance of photovoltaic modules and outdoor long-term reliability. Background technique [0002] With the continuous extension of the route of cost reduction and efficiency increase of photovoltaic modules, various high-efficiency technologies have been applied to module manufacturing, such as IBC, N-type, double-sided and other modules, and EVA has been unable to meet the anti-PID requirements of such modules. POE packaging material is the best choice to replace EVA. However, due to its structural limitations, POE has high cost, low friction coefficient, slow crosslinking rate, and is prone to thermal creep, resulting in increased component costs, reduced production capacity, and reduced production yield. In addition, due to the poor compatibility of POE with most polar ...

Claims

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Application Information

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IPC IPC(8): C09J7/24C09J123/08C09J11/06C09J11/08
CPCC08K5/103C08L71/02C09J7/24C09J11/06C09J11/08C09J123/0853C09J2203/322C09J2301/124C09J2301/408
Inventor 李民季志超杨英
Owner SHANGHAI HIUV NEW MATERIALS
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