Automatic chip stacking device

Abstract

The invention discloses an automatic chip stacking device. The device comprises a controller, wherein an output end of the controller is electrically connected with a material taking auxiliary device,the output end of the controller is electrically connected with a suction cup proceeding system, an output end of the suction cup proceeding system is electrically connected with a suction cup, and the output end of the controller is electrically connected with a vacuum generation device. Through mutual cooperation of the controller, the material taking auxiliary device, the suction cup carryingsystem, the suction cups, a vacuum generation device, a stock bin conversion device, a chip storage device, an HMI human-computer interface and an upper computer, high stacking precision and good stability are achieved, the automatic stacking device is advantaged in that problems that an automatic stacking device in the prior art is poor in stacking precision and poor in stability are solved, whenpeople use the automatic stacking device, chips can be accurately placed without shaking, use requirements of production can be met, people can use the automatic stacking device conveniently, and practicability of the automatic stacking device is improved.

Description

technical field [0001] The invention relates to the technical field of chip production and processing, in particular to an automatic stacking device for chips. Background technique [0002] A chip is an integrated circuit that manufactures a circuit on the surface of a semiconductor chip, also known as a thin-film integrated circuit. Another thick-film integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board. [0003] In the process of chip production and processing, automatic stacking devices need to be used. Currently, existing automatic stacking devices (such as figure 2 As shown), the stacking accuracy is poor and the stability is poor. When people use the automatic stacking device, they cannot place the chip accurately and are prone to shaking, which cannot meet the needs of production. It is inconvenient for people to use and reduces the practicality of the automatic s...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides an automatic stacking device for chips, which has the advantages of high stacking accuracy and good stability, and solves the problem of poor stacking accuracy and poor stability of the existing automatic stacking device

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