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A segmented board manufacturing method based on stepped gold-plated plug-type PCB circuit boards

A technology for PCB circuit boards and plugs, applied in the field of PCB board manufacturing, can solve the problems of non-compliance of gold surface scratches, affecting the integrity of signal transmission, and black spots of residual glue on the gold surface of plugs.

Active Publication Date: 2021-09-21
广州广合科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the plug must be gold-plated first and the gold-plated leads must be removed before pressing. The surface of the gold-plated plug will be polluted by PP powder during pressing, resulting in black spots on the gold surface of the plug. After repair, there will be scratches on the gold surface that do not meet the requirements. , affecting the integrity of the signal transmission

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0047] Select the sub-board containing the plug according to the design requirements. The gold-plated leads and the plug positions that need to be gold-plated are reserved, and the rest of the board is covered and protected by a wet film process. Using gold-plated leads as a medium can increase the gold content of the gold-plating process, which is better than the gold-plating method without using gold-plated leads. After the gold-plating is completed to obtain the gold-plated plug, the board is immersed in 4-7% sodium hydroxide solution at 50-60° C. to remove the film. After the stripping is completed, the plate is etched to remove the gold-plated lead to obtain a gold-plated plug pattern without the gold-plated lead. Paste the complete gold-plated plug graphics with high-temperature-resistant PI tape. After confirming that it is attached, the tape is cut with a laser to remove the excess tape. Then browning treatment is carried out on the board, which can remove grease an...

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Abstract

The present invention relates to a segmental method for manufacturing a PCB circuit board based on a ladder gold-plated plug type. The gold-plated lead is used as a medium for gold-plating process; the wet film produced in step S1 is removed; the gold-plated lead in step S2 is removed by etching; the protective tape is pasted on the pattern of the gold-plated plug, and the tape is cut with a laser to remove the excess; Carry out browning treatment on the sub-board pasted with protective tape in step S5, and press according to the board parameters to obtain a laminated board; perform a surface treatment process on the laminated board obtained in step S6; expose the gold-plated plug at the step position through the blind gong; Peel off the protective tape on the surface of the gold-plated plug to obtain a gold-plated plug with a clean surface. The gold-plated plug is pre-protected by PI tape, so that the gold-plated plug does not come into contact with PP and other types of media in the subsequent pressing process.

Description

technical field [0001] The invention relates to the field of PCB board manufacturing, in particular to a segmented board-making method based on a stepped gold-plated plug-type PCB circuit board. Background technique [0002] At present, the process of stepped printed plugs in the industry is to expose the blind gongs at the stepped position after the mother board is pressed. There is PP residue on the surface of the plug for repair, and then the gold-plated plug is completed through gold-plated leads. [0003] Stepped gold-plated plugs have a graded or segmented design requirement, and gold-plated leads are not allowed to remain. Therefore, the plug must be gold-plated first and the gold-plated leads must be removed before pressing. The surface of the gold-plated plug will be polluted by PP powder during pressing, resulting in black spots on the gold surface of the plug. After repair, there will be scratches on the gold surface that do not meet the requirements. , affecting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K3/06H05K3/28
CPCH05K3/06H05K3/28H05K3/403H05K2201/09845H05K2203/1383
Inventor 兰富民麦美环巩杰王平
Owner 广州广合科技股份有限公司
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