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Preparation method of high-heat-conductive graphene/chopped carbon fiber composite material

A technology of chopped carbon fiber and high thermal conductivity graphite, which is applied in the field of composite materials, can solve the problem of low thermal conductivity and achieve high thermal conductivity, enhanced bonding, and easy-to-obtain effects

Active Publication Date: 2020-03-10
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, have significant anisotropic thermal conductivity for existing graphene material, promptly only have high thermal conductivity (greater than 1000W / mK) along the graphene plane and vertical In the thickness direction of its horizontal plane, the thermal conductivity is too low (less than 10W / mK), and a method for preparing a graphene / based carbon composite material with high thermal conductivity along the horizontal direction and thickness direction is provided.

Method used

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  • Preparation method of high-heat-conductive graphene/chopped carbon fiber composite material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The polyamic acid was diluted in DMAC to obtain a polyamic acid solution with a concentration of 2%, and then 0.5 g of reduced graphene oxide (rGO) and 0.5 g of chopped carbon fibers were weighed and dispersed in the polyamic acid solution. It was placed in an ultrasonic disperser, ultrasonicated for 2 hours to obtain a uniform dispersion. The dispersion was left to stand for 24 hours to allow the rGO and carbon fibers to settle freely, the upper liquid was removed, and the solvent DMAC was replaced by ethanol impregnation, and then the composite material was dried by supercritical to obtain a graphene / carbon fiber / polyamic acid composite material.

[0028] The obtained composite material was placed in a graphite mold, a pressure of 0.5 MPa was applied, and it was thermally aminated at 350° C. for 30 minutes to obtain a graphene / carbon fiber / polyimide composite material. Then, under the condition of inert gas in a tube furnace, heat treatment at 1000° C. for 1 h, so tha...

Embodiment 2

[0030] The polyamic acid was diluted in DMAC to obtain a polyamic acid solution with a concentration of 1%, and then 0.5 g of reduced graphene oxide (rGO) and 0.5 g of chopped carbon fibers were weighed and dispersed in the polyamic acid solution. It was placed in an ultrasonic disperser, ultrasonicated for 2 hours to obtain a uniform dispersion. The dispersion was left to stand for 24 hours to allow the rGO and carbon fibers to settle freely, the upper liquid was removed, and the solvent DMAC was replaced by ethanol impregnation, and then the composite material was dried by supercritical to obtain a graphene / carbon fiber / polyamic acid composite material.

[0031] The obtained composite material was placed in a graphite mold, a pressure of 1 MPa was applied, and the thermal amination treatment was carried out at 350° C. for 40 minutes to obtain a graphene / carbon fiber / polyimide composite material. Then, under the condition of inert gas in a tube furnace, heat treatment at 1000...

Embodiment 3

[0033]The polyamic acid was diluted in DMAC to obtain a polyamic acid solution with a concentration of 5%, and then 0.5 g of reduced graphene oxide (rGO) and 0.5 g of chopped carbon fibers were weighed and dispersed in the polyamic acid solution. It was placed in an ultrasonic disperser, ultrasonicated for 2 hours to obtain a uniform dispersion. The dispersion was left to stand for 24 hours to allow the rGO and carbon fibers to settle freely, the upper liquid was removed, and the solvent DMAC was replaced by ethanol impregnation, and then the composite material was dried by supercritical to obtain a graphene / carbon fiber / polyamic acid composite material.

[0034] The obtained composite material was placed in a graphite mold, a pressure of 3 MPa was applied, and a heat amination treatment was performed at 400° C. for 15 minutes to obtain a graphene / carbon fiber / polyimide composite material. Then, under the condition of inert gas in a tube furnace, heat treatment at 1000° C. for...

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Abstract

The invention discloses a preparation method of a high-heat-conductive graphene / chopped carbon fiber composite material. By means of high heat-conductivity of graphene in in-plane direction and high heat-conductivity of carbon fibers in axial direction, the graphene layer and the chopped carbon fibers are subjected to deposition molding in a liquid phase, and by means of adhesion effect of polyimide, the carbon fibers and graphene are connected, and finally, through carbonization and graphitization, the polyimide is converted into graphene, thus manufacturing the whole-carbon high-heat-conductive composite material. A conventional graphene material has ultrahigh heat conductivity in horizontal plane due to the two-dimensional structure of graphene but is poor in heat conductivity since thegraphene is lack in heat conductive path in thickness direction; therefore, by means of the axial high heat-conductivity, the high heat-conductive paths are formed between the graphene layers, so that the heat-conductivity of the material in thickness direction is vertically improved, and the defect of poor heat conductivity in the thickness direction is overcome, thereby preparing the high-heat-conductive material.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and more specifically relates to a preparation method of a graphene / chopped carbon fiber composite material with high thermal conductivity, specifically a graphene / chopped carbon fiber composite material with high thermal conductivity along the thickness direction and the horizontal direction. Preparation method of carbon matrix composite material. Background technique [0002] With the rapid development of science and technology in the fields of computer, communication and aerospace, the power of electronic products is increasing and the size is getting smaller and smaller, which makes thermal management more and more difficult. Require. For example, the surface temperature of microelectronic chips must be maintained at a relatively low temperature (such as silicon devices <100°C) to ensure their high-performance operation. If there is no sufficient thermal management guarantee, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/83
CPCC04B35/83C04B2235/48C04B2235/9607
Inventor 封伟张飞冯奕钰高龙
Owner TIANJIN UNIV
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