Reliability simulation test model correction method
A test model and reliability technology, used in design optimization/simulation, special data processing applications, instruments, etc., can solve problems such as low calculation efficiency and rough target accuracy, and achieve the effect of improving correctness and reliability
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Embodiment 1
[0039] This patent proposes a reliability simulation test model correction method, which includes a printed circuit board assembly (PCBA) dynamic model correction method and a thermodynamic model correction method, the specific content is as follows:
[0040] 1. Modification method of printed circuit board assembly dynamic model
[0041] The kinetic model correction method includes: initial screening of parameters; quantitative correlation analysis of the screened parameters, and selection of parameters with a correlation coefficient of 0.3-1 as parameters to be corrected; construction of a response surface model for the parameters to be corrected, Fit the polynomial response surface function of the first n order simulation modal frequency y of the printed circuit board assembly and the parameter xi to be corrected; take the minimum value of the absolute value of the difference between the predicted value of the response surface and the measured value as a multi-objective optimiz...
Embodiment 2
[0079]In this embodiment, a certain PCBA in an avionics product is selected to correct its kinetic model and thermodynamic model according to the method of this patent.
[0080] 1. Select a certain PCBA in an avionics product to correct its dynamic model according to the method of this patent. The implementation steps are as follows:
[0081] Step 1: Modal Testing and Initial Simulation
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