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Printed wiring board

A technology for printed wiring substrates and wiring substrates, which is applied in the directions of printed circuits, printed circuits, and printed circuit manufacturing, and can solve the problems of easy suction of flux, narrowing of gaps, and capillary phenomenon.

Active Publication Date: 2020-02-18
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, due to this miniaturization and the increase in the number of pins, the internal structure is complicated, resulting in the narrowing of the space between the parts constituting the connector part, such as the metal case, the contact, and the mold, causing capillary tubes in the space when the solder reflows. Phenomenon, flux is easy to be sucked up

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0034] figure 1 It is a perspective view of a printed wiring board 1 used in electronic equipment such as a mobile phone or a digital camera, for example.

[0035] figure 2 yes figure 1 The L1-L1 sectional view of , but the section of the housing 101 is omitted.

[0036] Such as figure 1 and figure 2 As shown, the printed wiring board 200 of this embodiment includes a wiring board 110A and a USB connector 100 mounted on the wiring board 110A as main elements. The USB connector 100 is an example of a surface mount type connector component.

[0037] According to the present embodiment, wiring board 110A has cutting portion 4 . The cutting portion 4 is cut out to form an opening on one side of the outer peripheral edge of the wiring board 110A. The cutout 4 defines a rectangular space into which the USB connector 100 enters.

[0038] Furthermore, wiring board 110A has flat surface 5 a and rear surface 5 b that are continuous with cut portion 4 . Four reinforcement pads...

no. 2 approach

[0075] Figure 7 A schematic diagram showing a state before reflow of the guide groove used in the second embodiment is shown in .

[0076] As shown in the figure, two guide grooves 135 - 2 and 138 - 2 are connected to the reinforcing land 112 - 4 of the wiring board used in the second embodiment. The guide groove 135-2 has a first guide groove 133-2 connected to the side 151-4 of the reinforcement pad 112-4 and extending in a direction from the side 151-4 toward the rear end of the housing 101, and The second guide groove 134 - 2 extends away from the housing 101 in the width direction of the housing 101 continuously from the first guide groove 133 - 2 . In addition, the guide groove 138-2 is the same as the guide groove 135-2, and is connected to the side 152-4 of the reinforcing pad 112-4 that is opposite to the side 151-4, and is connected to the housing 101 from the side 152-4. The first guide groove 136-2 extending in the direction of the front end of the housing 101, ...

no. 3 approach

[0088] Figure 11 A schematic diagram showing a state before reflow of the guide groove used in the third embodiment is shown in .

[0089] As shown in the figure, a wiring board 110C used in the third embodiment is formed by placing a receiving film 140 made of a resin film such as polyimide having a rectangular shape of, for example, a size of 10 mm×10 mm and a thickness of 0.3 mm through an adhesive. Paste on the first guide groove 136-2 connected to the guide groove 138-2 of the reinforcement pad 112-4 to the second guide groove 137-2 to increase the area where capillary phenomenon occurs, and has the same Figure 7 Same composition.

[0090] As a material of a receiving film, heat-resistant resin films, such as PI, PTFE, polyester, are mentioned, for example. In addition to the resin film, porous materials such as ceramics, carbon materials, and porous silica can be used.

[0091] Except for using the wiring board 110C provided with such a guide groove and a receiving ...

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Abstract

According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material, and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.

Description

[0001] This application is based on Japanese Patent Application No. 2018-147787 (filing date: 8 / 6 / 2018), and enjoys priority rights from this application. This application incorporates the entire content of this application by reference. technical field [0002] Embodiments of the present invention relate to a printed wiring board. Background technique [0003] In electronic equipment, the miniaturization and unitization of connector parts have promoted the complication of the internal structure, which contributes to the miniaturization and weight reduction of products. In addition, regarding the thickness of the product, in addition to the component type called "on board" in which the connector component is mounted on the printed wiring board (PWB), a part of the PWB is cut off and the connector component is mounted. Offset (offset) components contribute to thinning. [0004] Along with the miniaturization of connector parts, durability against prying when handled by the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02
CPCH05K1/181H05K1/02H01R4/027H01R12/722H05K2201/10189H05K3/3405H05K2201/09063H05K2201/09781H05K3/3452H05K3/3447H05K2201/09036H05K2203/046H01R4/028H05K2201/2027H05K1/117
Inventor 田中章平岛正也安井聪山田淑代渡边将史
Owner KK TOSHIBA
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