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Polymethyl methacrylate (PPMA) coated microcapsule type fast curing agent with long storage period and for epoxy resin as well as preparation method and application of curing agent

A fast-curing technology for epoxy resin, which is applied in the field of PPMA-wrapped microcapsule-type fast curing agent for epoxy resin with a long storage period. It can solve the problems of poor experiment repeatability and complicated preparation process of curing agent, and achieve good storage performance. Effect

Inactive Publication Date: 2020-02-04
肇庆市海特复合材料技术研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention is to solve the complex preparation process of the existing curing agent, sometimes it is necessary to adjust the pH value and heating and cooling to make the reaction happen, special reaction reagents are needed, and the repeatability of the experiment is poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0017] Embodiment 1: In this embodiment, a long-storage epoxy resin uses PPMA to wrap microcapsule-type fast curing agents. The core material is an active curing agent, and the wall material is polymethyl methacrylate.

specific Embodiment approach 2

[0018] Embodiment 2: This embodiment is different from Embodiment 1 in that: the active curing agent is imidazole or its derivatives. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0019] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the active curing agent is imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, benzimidazole, 2 - phenyl-4-methylimidazole or 2-ethyl-4-methylimidazole. Others are the same as in the first or second embodiment.

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PUM

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Abstract

The invention relates to a polymethyl methacrylate (PPMA) coated microcapsule type fast curing agent with long storage period and for epoxy resin as well as a preparation method and application of thecuring agent. The invention aims to solve the problem that an existing curing agent is complicated in preparation process, the reaction is conducted by adjusting the pH value and through heating andcooling, a special reaction reagent is needed and the experimental repeatability is low as well as the problem that most of the wall materials of some curing agents are polymers with low heat resistance and are liable to decompose or volatilize and are not suitable for preparing epoxy resin prepreg. An active curing agent serves as a core material and the PPMA serves as a wall material; and microencapsulated solvent volatilization is realized by a physical method. The curing agent is used for preparing the epoxy resin prepreg.

Description

technical field [0001] The invention relates to a PPMA-wrapped microcapsule type fast curing agent for epoxy resin with a long storage period and a preparation method and application thereof. Background technique [0002] Epoxy resin is a typical thermosetting resin. It contains more than two epoxy groups in its molecular chain. It is in a viscous liquid state at room temperature. When it interacts with a curing agent, it will solidify and cross-link into a three-dimensional network-like macromolecular structure. Epoxy resin has excellent mechanical, physical properties, good chemical stability, low molding shrinkage, and good dimensional stability, so it has been widely used in electronic packaging, construction and aerospace, automotive and other fields. In industrial production, epoxy resin needs to be stored separately from the curing agent, and then reconstituted when used, stirred evenly and then cured, which greatly reduces the efficiency of producing epoxy resin prod...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08J5/24C08L63/00
CPCC08G59/5073C08J5/24C08J2363/00
Inventor 徐忠海赫晓东蔡朝灿白玉娇王荣国刘文博董旭伦
Owner 肇庆市海特复合材料技术研究院
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