Monitoring component, system and method based on running state of system-in-package device

Abstract

The invention discloses a monitoring component, system and method based on the running state of a system-in-package device. The monitoring component comprises a test board used for installing a system-in-package device, a main control board and a PC. The test board is in signal connection with the main control board, the main control board provides a power supply, a clock signal and a reset signalfor the test board, and controls the test process of the test board on the system-in-package device, the main control board is in signal connection with the PC, and the PC acquires a test result of test data generated in the process of testing the system-in-package device by the test board. The invention provides a SiP device function operation state monitoring component, system and method. The operation state monitoring method research is carried out for the SiP device. Through the arrangement of the test board, the function monitoring circuit design of the SiP device is completed, the maincontrol board controls the work of the test board, the test result of the SiP device in the strengthening test is obtained in real time, the defects of the SiP device can be captured in real time, andthen the test accuracy of the SiP device is improved.

Description

technical field [0001] The invention relates to the technical field of component reliability, in particular to a monitoring component, system and method based on the operating state of a system-in-package device. Background technique [0002] SiP (System In a Package) device is a component that integrates chips with a multifunctional substrate. SiP devices are lighter and more reliable, and are becoming more and more popular in the market. In order to ensure the normal use of system-in-a-package devices , it is necessary to monitor its functional operating status. [0003] The traditional functional monitoring method is to regularly test the SiP devices during each intensive test project to determine whether the tested samples have abnormal functions, but some defects will return to normal after losing the intensive test environment, for example, through Defects excited by stress, the existing methods cannot capture such defects in real time, thus making the results of SiP ...

AI Technical Summary

Problems solved by technology

[0003] The traditional functional monitoring method is to regularly test the SiP devices during each intensive test project to determine whether the tested samples have abnormal functions, but some defects will return to normal after losing the intensive test environment, for example, through Defects excited by stress, the existing methods cannot capture such defects in real time, which makes the results of SiP device functional operation monitoring inaccurate

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