Modified epoxy resin emulsion, and preparation method and application thereof
An epoxy resin emulsion, epoxy resin technology, applied in epoxy resin coatings, coatings, conductive coatings, etc., can solve problems such as poor conductivity, poor sealing performance, poor stability, etc., to slow down or prevent damage, and facilitate batch production. The effect of production, long-lasting electrical conductivity
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[0017] A method for preparing a modified epoxy resin emulsion provided by an embodiment of the present invention includes: mixing N, N, N', N'-tetramethyl-1,6-hexamethylenediamine, bisphenol A type epoxy The mixed reaction system of resin and organic solvent is heated to 50-70°C and reacted for more than 2 hours, then the pH value of the obtained reaction mixture is adjusted to 6.5-7, and then water is added to obtain a modified epoxy resin emulsion.
[0018] Wherein, by mixing and heating N, N, N', N'-tetramethyl-1,6-hexanediamine, bisphenol A type epoxy resin and solvent to carry out the described reaction, the bisphenol A type ring can be opened epoxy bonds in the epoxy resin and introduce hydroxyl and amino groups to obtain the modified epoxy resin emulsion.
[0019] In some embodiments, the preparation method specifically includes: after mixing N,N,N',N'-tetramethyl-1,6-hexanediamine, bisphenol A type epoxy resin with an organic solvent, Then, the reaction is carried out...
Embodiment 1
[0054] 0.5 mol mass ratio of epoxy novolak and E20 mixed resin and 0.5 mol mass ratio of 1: 1 acetone and ethyl acetate mixed solvent were added to the three-necked flask, wherein the three-necked flask was equipped with thermometer, condensing Tube and dropping funnel. Add 0.25 mol of N, N, N', N'-tetramethyl-1,6-hexanediamine and slowly raise the temperature to 50°C at a heating rate of 2°C / min for 2.5 hours of continuous reaction at a constant temperature, and then use rotary evaporation Drain the solvent in the system. Finally, adjust the pH value to 6.5-7 with acetic acid, add deionized water and stir until the viscosity is 300 cp after the reaction is complete, and prepare a modified epoxy resin emulsion with a solid content of 65%-75%.
[0055] The modified epoxy resin emulsion is used as a film-forming substance to prepare a conductive coating applied to the grounding grid. The preparation process is as follows:
[0056] Take an appropriate amount of solvent to fully...
Embodiment 2
[0058] Add 0.5 mol mass ratio of 1:1.5 novolac epoxy and E20 mixed resin and 0.5 mol mass ratio of acetone and ethyl acetate mixed solvent 1:1.5 into the three-necked flask, wherein the three-necked flask is equipped with a thermometer and a condenser and dropping funnel. Add 0.25 mol of N,N,N',N'-tetramethyl-1,6-hexanediamine and slowly raise the temperature to 60°C at a heating rate of 2°C / min for continuous reaction at a constant temperature for 3 hours, and then evaporate the The solvent in the system is discharged. Finally, adjust the pH value to 6.5-7 with acetic acid, add a certain amount of deionized water and stir until the viscosity is 270cp after the reaction is complete, and prepare a modified epoxy resin emulsion with a solid content of 60%-70%.
[0059] The preparation method of the conductive coating is the same as that of Example 1.
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