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Machining technology for reducing deformation of thin-wall parts

A processing technology and technology of thin-walled parts, which is applied in the field of processing technology to reduce the deformation of thin-walled parts, can solve problems such as poor flatness and parallelism, related size deviation, and deformation, so as to reduce production time and scrap rate, The effect of reducing the amount of deformation and simplifying the structure

Inactive Publication Date: 2019-11-12
靖江佳仁半导体科技有限公司
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AI Technical Summary

Problems solved by technology

Parts will be deformed during machine processing, resulting in poor flatness and parallelism, which will lead to deviations in the corresponding associated dimensions. It is more obvious in the processing of some thin-walled parts, and often continue to improve the plane due to poor flatness Otherwise, some high-precision dimensions cannot be guaranteed to be within the tolerance range during subsequent processing
[0003] In the past, in the processing of semiconductor thin plate parts, the processing methods were often sucker hair (use the suction cup to suck the thin plate parts for processing), four-sided pressure plate hair (use four pressure plates to press the four sides of the workpiece for processing), glue method (use glue to stick The back of the part is placed on the workbench for processing. These three methods have the characteristics of deformation after processing and the glue method is extremely difficult to remove after processing due to the large area of ​​glue.

Method used

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  • Machining technology for reducing deformation of thin-wall parts

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Embodiment Construction

[0017] The present invention is further described and understood by non-limiting examples below.

[0018] The invention provides a processing technology for reducing the deformation of thin-walled parts, which specifically includes the following steps:

[0019] (1) Rough machining of parts: process qualified rough parts, reserve 0.25 for the finished size, remove excess material, and process clamping positioning holes at the four corners of the parts;

[0020] (2) Tempering to relieve stress: Put the rough-machined parts into a box-type tempering furnace and heat for 2 hours at a heating temperature of 200°C. After heating, take the parts out and place them on a cooling tray, and cool them naturally in the air;

[0021] (3) Parts finishing: such as figure 1 , the positioning pin is inserted into the positioning hole to fix the reverse side of the part on the tooling plate 1, press the 4 corners of the part 3 with the pressure plate 2, tamp it with a rubber hammer, and then us...

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Abstract

The invention discloses a machining technology for reducing deformation of thin-wall parts, and belongs to the field of part machining. The machining technology comprises the following steps of (1) carrying out rough machining of the parts, (2) carrying out tempering and stress relief, (3) carrying out finish machining of the parts, and (4) carrying out inspection, wherein in the step (3), plate pressing and the glue method are combined and are improved, so that the flatness and the parallelism of the parts after finish machining are guaranteed.

Description

technical field [0001] The invention relates to the field of parts processing, in particular to a processing technology for reducing deformation of thin-walled parts. Background technique [0002] Machining refers to the process of changing the shape or performance of a workpiece through a mechanical device. Parts will be deformed during machine processing, resulting in poor flatness and parallelism, which will lead to deviations in the corresponding associated dimensions. It is more obvious in the processing of some thin-walled parts, and often continue to improve the plane due to poor flatness Otherwise, some high-precision dimensions cannot be guaranteed to be within the tolerance range during subsequent processing. [0003] In the past, in the processing of semiconductor thin plate parts, the processing methods were often sucker hair (use the suction cup to suck the thin plate parts for processing), four-sided pressure plate hair (use four pressure plates to press the f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 张伟黄国锋邵佳孙彬康乐乐
Owner 靖江佳仁半导体科技有限公司
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