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Edge grinding device and method

An edge grinding and grinding wheel technology, applied in grinding devices, grinding drive devices, grinding machine tools, etc., can solve the problems of difficult to cool wafers, burns, coin lines, etc., achieve sufficient cooling time, reduce contact frequency, reduce The effect of the risk of injury

Active Publication Date: 2019-11-05
XIAN ESWIN SILICON WAFER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention provides an edge grinding device and method, which are used to solve the problems of burns and coin marks on the wafer due to the difficulty in cooling the grinding part during the chamfering process

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  • Edge grinding device and method
  • Edge grinding device and method

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Embodiment Construction

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0038] Please refer to figure 1 , figure 1 It is a schematic structural diagram of an edge grinding device in the prior art. The edge grinding device 101 in the prior art is cylindrical, and a single-circle grinding groove is arranged on the outer surface. In the case of high-speed grinding, the workpiece 102 is continuously ground with the edge When the device 101 is in contact, the heat...

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Abstract

The invention provides an edge grinding device and method, and relates to the field of wafer grinding. The edge grinding device comprises a base, a grinding wheel, a grinding wheel supporting mechanism and a platform deck mechanism. The grinding wheel comprises a cylindrical grinding wheel axis and a thread-shaped grinding groove which is formed in the outer surface of the grinding axis and formedin the circumferential direction of the grinding wheel axis, and from one end of the grinding wheel axis to the other end of the grinding wheel axis, the shape and size of the thread-shaped grindinggroove are kept unchanged. The grinding wheel supporting mechanism is arranged on the base and used for vertically fixing the grinding wheel and controlling the grinding wheel to rotate and move in the vertical direction. The platform deck mechanism is arranged on the base and used for horizontally placing a to-be-machined workpiece and controlling the to-be-machined workpiece to rotate and move.According to the embodiment of the invention, the problem is solved that in the chamfering machining process, since contact points between a grinding device and a workpiece are hard to cool, the workpiece is burnt and has coin-shaped stripes.

Description

technical field [0001] The invention relates to the field of wafer grinding, in particular to an edge grinding device and method. Background technique [0002] In the semiconductor-level wafer processing technology, the chamfering process plays an important role in correcting edge damage, realizing the required contour, and releasing internal stress. Or missing. The chamfering grinding device grinds the wafer through the relative movement between the grinding mechanism and the wafer. During the processing, the position of the grinding mechanism is fixed and rotates at a high speed, and the edge grinding is completed through the relative displacement between the grinding wheel and the wafer. chipping effect. At present, the processing stroke of common chamfering and grinding equipment is limited, and it is difficult to cool the grinding part in time, which causes the problems of burns and coin marks on the wafer. At the same time, it is difficult to remove the debris genera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B9/06B24B37/02B24B37/11B24B47/12B24B47/22B24B47/20
CPCB24B9/065B24B37/02B24B37/11B24B47/12B24B47/20B24B47/22
Inventor 陈光林郑秉冑姜镕
Owner XIAN ESWIN SILICON WAFER TECH CO LTD
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