Method for manufacturing bushing, substrate supporting assembly and substrate processing apparatus

Abstract

The invention provides a method for manufacturing a bushing, a substrate supporting assembly and a substrate processing apparatus. The substrate support assembly may include a plate, a top rod, and abushing. The plate may be used to configure a substrate. The top rod can penetrate the plate to move upward and downward in order to support the bottom surface of the substrate. The bushing may have an internal hole through which the ejector pin passes for guiding movement of the ejector pin when the plate moves. The bushing may be obtained by an injection molding process using a molding member including a molding space for forming an outer shape of the bushing and an inner pin for forming the inner hole in order to simultaneously form the outer shape of the bushing and the inner hole.

Description

[0001] This application enjoys the priority of Korean Patent Application No. 10-2018-0048113 filed with the Korean Intellectual Property Office on April 25, 2018. technical field [0002] Exemplary embodiments of the present invention relate to a method of manufacturing a bushing, a substrate support assembly, and a substrate processing apparatus. More particularly, the exemplary embodiments of the present invention relate to a method of manufacturing a bushing that can be advantageously used in the manufacture of a semiconductor device or a display device, a substrate support assembly including such a bushing, and a substrate having the same Processing device. Background technique [0003] Processes such as a process for laminating layers on a substrate, an etching process for selectively etching layers formed on the substrate, and the like can be performed when manufacturing a semiconductor device or a display device. Engineering of the substrate may generally be performe...

AI Technical Summary

Problems solved by technology

In particular, the surface roughness of the inner hole of the bush formed by the secondary treatment is low, and the uniformity of the bush is low, so friction between the bush and the ejector pin may occurrence of particles

These particles can cause poor engineering in the engineering of the substrate

In addition, since the bush is manufactured through the injection molding process and the secondary processing, the time and cost required for manufacturing the bush can be increased.

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