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Epoxy resin adhesive and preparation method thereof

A technology of epoxy resin glue and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of slow curing reaction speed, unsatisfactory, and uncurable adhesive, and achieve the preparation method Simple, Gentle Effects

Active Publication Date: 2019-10-18
SHANDONG EFIRM BIOCHEMISTRY & ENVIRONMENTAL PROTECTION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, this type of adhesive cannot be cured at low temperature, and the curing reaction speed is slow, so it is not suitable for fast operation, so it cannot meet the requirements of fast potting on the production line of the electronic and electrical industry, fast bonding in the modern architectural decoration industry, expressway express delivery, etc. Requirements for fast curing performance at room temperature in fields such as repairing damaged pavements and rapid leak repair in the construction and civil engineering industries

Method used

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  • Epoxy resin adhesive and preparation method thereof
  • Epoxy resin adhesive and preparation method thereof
  • Epoxy resin adhesive and preparation method thereof

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preparation example Construction

[0049] The present invention also provides a preparation method of the epoxy resin adhesive described in the above technical scheme, comprising the following steps:

[0050] a) mixing the amine curing agent and mercaptan to obtain a mixture;

[0051] b) adding epoxy resin to the mixture obtained in step a), performing degassing and stirring to obtain an epoxy resin adhesive.

[0052] In the present invention, firstly, the amine curing agent and mercaptan are mixed to obtain a mixture. In the present invention, the amine curing agent and mercaptan are the same as those described in the above technical solution, and will not be repeated here.

[0053]In the present invention, the mixing device preferably adopts a reactor known to those skilled in the art; the mixing method is preferably high-speed stirring; the rotating speed of the high-speed stirring is preferably 1500r / min~3500r / min, more preferably 3000r / min.

[0054] In the present invention, the mixing temperature is pr...

Embodiment 1

[0071] The formula quantity of the raw materials used in Example 1 is shown in Table 1.

[0072] The formula quantity of raw material used in table 1 embodiment 1

[0073] raw material Mass / kg 1,2-Dimethylpropylamine 5 Thiol 41 Epoxy resin E20 48

[0074] (1) Add 1,2-dimethylpropylamine and mercaptan into the reaction kettle, and perform high-speed stirring at 3000r / min at 25°C for 1.5h to 2h to disperse the two evenly to obtain a mixture;

[0075] (2) In the mixture obtained in step (1), slowly add epoxy resin E20 within 4 minutes. After the addition is completed, degas and stir at 3000r / min and 20°C for 3 minutes to 5 minutes to obtain epoxy resin glue adhesive.

[0076] After testing, the epoxy resin adhesive provided by Example 1 of the present invention has a gel time of 13 minutes at room temperature, a curing time of 19 minutes, a tensile shear strength of 9.7 MPa, and a tensile shear strength of 7.6 MPa after being soaked in machine o...

Embodiment 2

[0078] The formulation amount of the raw materials used in Example 2 is shown in Table 2.

[0079] The formula quantity of raw material used in table 2 embodiment 2

[0080] raw material Mass / kg N,N-Dimethylethanolamine 4 Thiol 36 Epoxy resin E20 52

[0081] (1) Add N,N-dimethylethanolamine and mercaptan into the reaction kettle, and carry out high-speed stirring at a speed of 3000r / min at 25°C for 1.5h to 2h to disperse the two evenly to obtain a mixture;

[0082] (2) In the mixture obtained in step (1), slowly add epoxy resin E20 within 4 minutes. After the addition is completed, degas and stir at 3000r / min and 20°C for 3 minutes to 5 minutes to obtain epoxy resin glue adhesive.

[0083] After testing, the epoxy resin adhesive provided in Example 2 of the present invention has a gel time of 12 minutes at room temperature, a curing time of 17 minutes, a tensile shear strength of 10.6 MPa, and a tensile shear strength of 9.7 MPa after being s...

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Abstract

The invention provides an epoxy resin adhesive. The epoxy resin adhesive is prepared from the following components in parts by weight: 1-15 parts of an amine curing agent, 30-60 parts of mercaptan, and 35-55 parts of epoxy resin; and the mercaptan has a structure shown in a formula (I) or a formula (II) (please see the specification for the formula (I) or the formula (II)), wherein R1 is trivalenthydrocarbyl of C1 to C6, and R2 is selected from a formula (please see the specification for the formula), and n is an integer from 1 to 5. Compared with the prior art, according to the epoxy resin adhesive, the components of the specific content are adopted, and good interaction is achieved, so that the epoxy resin adhesive has good room-temperature rapid curing performance, and is high in tensile and shear strength and good in oil and water resistance. Experimental results show that the gelation time of the epoxy resin adhesive at the room temperature is 6-13 min, the curing time is 10-19 min, the tensile and shear strength is 9.7-15.4 MPa, and the tensile and shear strength after oil soaking for half a year is 7.6-13.7 MPa.

Description

technical field [0001] The invention relates to the technical field of epoxy resin curing agent, more specifically, relates to an epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin adhesives generally refer to adhesives made with epoxy resin as the main body. Compositions using a compound containing a thiol group (another name: sulfanyl group or mercapto group, -SH) as a curing agent for an epoxy resin have excellent low-temperature curability, and therefore various studies have been conducted by those skilled in the art. At present, the adhesives using compounds containing thiol groups as curing agents in the prior art have the characteristics of simple operation process and can be cured without external force. [0003] However, this type of adhesive cannot be cured at low temperature, and the curing reaction speed is slow, so it is not suitable for fast operation, so it cannot meet the requirements of fast potting on the produ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C08G59/56C08G59/66
CPCC08G59/56C08G59/66C09J163/00
Inventor 王树建梁万根崔卫华张超费潇瑶孙志利靖培培
Owner SHANDONG EFIRM BIOCHEMISTRY & ENVIRONMENTAL PROTECTION CO LTD
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