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Manufacturing method of high-frequency mixed pressure printed circuit board

A printed circuit board and manufacturing method technology, applied in the directions of printed circuit manufacturing, printed circuit, multilayer circuit manufacturing, etc., can solve the problems of poor surface copper uniformity, insufficient filling of high-frequency mixed-pressure HDI boards, etc., to reduce Layer copper thickness, reducing labor and material cost input, optimizing the effect of hole filling parameters

Pending Publication Date: 2019-10-15
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a method for making a high-frequency mixed-pressure printed circuit board. The present invention solves the problem that the filling holes of the high-frequency mixed-pressure HDI board are not full; Surface copper ratio filling parameters, improve the quality problems of surface copper thickness and poor uniformity in the traditional process, and reduce the cost of manpower and materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A method for manufacturing a high-frequency mixed-pressure printed circuit board, which is characterized in that it includes the following steps: material cutting → inner layer → etching → inspection → browning → pressing → copper reduction → laser drilling → desmear → sinking Copper→hole filling→copper reduction→hole filling→copper reduction→drilling→glue removal→board electrical→outer layer pattern transfer→etching→AOI inspection→solder mask printing→text printing→forming→flying probe test→immersion silver→appearance Check → Pack.

[0031] Further, the cutting includes: one bottom copper plate is used for L3-L4 layer core boards, and two bottom copper plates are used for L1-L2 and L5-L6 layer core boards.

[0032] Further, the inner layer includes: film pre-expansion coefficient setting of L3-L4 layer X direction=+3 / 10,000; Y direction=+2 / 10,000, L1-L2 and L5-L6 film pre-expansion coefficient setting X direction= +4 / 10,000, Y direction=+3 / 10,000, add 4 groups of symb...

Embodiment 2

[0042] A method for manufacturing a high-frequency mixed-pressure printed circuit board, which is characterized in that it includes the following steps: material cutting → inner layer → etching → inspection → browning → pressing → copper reduction → laser drilling → desmear → sinking Copper→hole filling→copper reduction→hole filling→copper reduction→drilling→glue removal→board electrical→outer layer pattern transfer→etching→AOI inspection→solder mask printing→text printing→forming→flying probe test→immersion silver→appearance Check → Pack.

[0043] Further, the cutting includes: one bottom copper plate is used for L3-L4 layer core boards, and two bottom copper plates are used for L1-L2 and L5-L6 layer core boards.

[0044] Further, the inner layer includes: film pre-expansion coefficient setting of L3-L4 layer X direction=+3 / 10,000; Y direction=+2 / 10,000, L1-L2 and L5-L6 film pre-expansion coefficient setting X direction= +4 / 10,000, Y direction=+3 / 10,000, add 4 groups of symb...

Embodiment 3

[0054] A method for manufacturing a high-frequency mixed-pressure printed circuit board, which is characterized in that it includes the following steps: material cutting → inner layer → etching → inspection → browning → pressing → copper reduction → laser drilling → desmear → sinking Copper→hole filling→copper reduction→hole filling→copper reduction→drilling→glue removal→board electrical→outer layer pattern transfer→etching→AOI inspection→solder mask printing→text printing→forming→flying probe test→immersion silver→appearance Check → Pack.

[0055] Further, the cutting includes: one bottom copper plate is used for L3-L4 layer core boards, and two bottom copper plates are used for L1-L2 and L5-L6 layer core boards.

[0056] Further, the inner layer includes: film pre-expansion coefficient setting of L3-L4 layer X direction=+3 / 10,000; Y direction=+2 / 10,000, L1-L2 and L5-L6 film pre-expansion coefficient setting X direction= +4 / 10,000, Y direction=+3 / 10,000, add 4 groups of symb...

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Abstract

The invention provides a manufacturing method of a high-frequency mixed pressure printed circuit board. The method is characterized in that the method comprises the following steps: cutting-inner layer processing-etching-inspection-browning-pressing-copper reduction-laser drilling-gum residue removal-copper plating-porefilling-copper reduction-porefilling-copper reduction-drilling-degumming-boardplating-outer pattern transfer-etching-AOI detection-solder resist printing-text printing-moulding-flying probe test-silver plating- appearance inspection-packaging. The method solves the problem of not full hole filling of a high-frequency mixed pressure HDI board, optimizes hole filling and surface copper proportion hole filling parameters of the high-frequency mixed pressure HDI board, improvesthe quality problems of thick surface copper and poor uniformity in the prior art and reduces input of labor and material cost.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board processing, and in particular relates to a method for manufacturing a high-frequency mixed-voltage printed circuit board. Background technique [0002] High-frequency mixed-pressure printed circuit board products have emerged with the development of communication technology and the telecommunications industry. They can break through the bottleneck of high-speed data and high-volume transmission of traditional printed circuit boards. Therefore, high-frequency laminate materials Rogers4350 and FR4 prepreg ( pp) materials are mixed and pressed, and high-frequency materials are used to make two new types of interconnected blind holes. This kind of stacking produces L1-L2 layer and L1-L3 layer electroplating and filling holes. It is difficult, and blind holes and through holes At the same time, the difference in depth capability of electroplating affects the effect of copper plating. ...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/42
CPCH05K3/4688H05K3/429
Inventor 曾宪悉邱成伟刘德威杨颖颖李小海
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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