Optical module heat-dissipation structure

Abstract

The invention relates to an optical module heat-dissipation structure. The optical module heat-dissipation structure comprises a flexible printed circuit board and a flexible heat conduction part, wherein the flexible heat conduction part comprises a first fixing part, a second fixing art and a bending part; an inner side of the first fixing part and an inner side of the second fixing part are opposite to each other; the first fixing part and the second fixing part are connected together through the bending part; the flexible printed circuit board is fixedly arranged on the inner side of the second fixing part; at least one optical module is arranged between the inner side of the first fixing part and the flexible printed circuit board in a pluggable way; and a heat-dissipation part are fixedly arranged on outer sides of the first fixing part and the second fixing part respectively. The optical module heat-dissipation structure is simple, improves the overall heat-dissipation effect remarkably, enables a temperature-sensitive laser in the optical module to work smoothly, and is easy to plug and unplug, convenient to use, and suitable for generalization.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an optical module heat dissipation structure. Background technique [0002] An optical module is an integrated module that converts optical signals into electrical signals and / or converts electrical signals into optical signals. It is usually mounted on a printed circuit board and plays an important role in optical fiber communication in the communication field. . With the rapid development of 4G communication and even 5G communication, the market demand for high-speed optical modules is increasing day by day. [0003] However, during the working process of the optical module, a large amount of heat will be generated. The laser in the optical module is the most important power consumption device in the optical module, especially the laser for generating optical signals, which generates the most heat. Taking the 100G optical module as an example, its power consumpt...

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Problems solved by technology

However, this type of heat dissipation structure often ignores the full range of heat dissipation for the optical module. In addition to considering heat dissipation on the upper surface of the optical module, it is also necessary to consider heat dissipation on other surfaces, which has the problem of large thermal resistance. The effect is not good; and in order to dissipate the heat of the optical module in time, a thick thermal pad is usually required, which makes the compression force of the thermal pad very large, resulting in the difficulty of plugging and unplugging the optical module

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