Memory liquid-cooling heat dissipation method and device as well as system

Abstract

The embodiment of the invention provides a memory liquid-cooling heat dissipation device which comprises a liquid inlet pipe, a connecting pipe, a liquid-cooling block, a liquid outlet pipe and a mainboard, wherein the liquid inlet pipe, the liquid outlet pipe and the liquid-cooling block are fixed on the mainboard; the liquid inlet pipe and the liquid outlet pipe are respectively positioned at two ends of the liquid-cooling block; a memory slot is also arranged on the mainboard and is close to the liquid-cooling block; the liquid-cooling block is composed of a metal block, metal domes arranged at two sides of the metal block and a liquid passageway penetrated through the metal block; the liquid inlet pipe, the liquid passageway inside the metal block and the liquid outlet pipe are communicated by the connecting pipe to form a cooling liquid loop; correspondingly, the embodiment of the invention also provides a memory liquid-cooling heat dissipation method and system; according to the technical scheme, the heat dissipation on the memory is realized; meanwhile, as the liquid-cooling block is in contact with a memory bank only through the metal domes, the memory bank can be very convenient to insert and pull out without dismantling the liquid-cooling block when the memory bank is maintained, thereby the risk caused by cooling liquid leakage is reduced.

Description

technical field [0001] The present invention relates to the field of computers, in particular to a memory liquid cooling method, device and system. Background technique [0002] In order to deal with the rapidly increasing amount of information, servers and minicomputers must continuously improve their computing performance, requiring more components with faster computing speeds, which makes the system heat increase rapidly, and at the same time, due to servers and minicomputers The volume of the machine is limited, and the layout of components is relatively compact, so the heat consumption density of the system increases sharply. At present, the heat dissipation of the system has become the main bottleneck restricting the performance improvement of servers and minicomputers, and the traditional air-cooling method has reached the point where it is difficult to deal with this problem. The main heat dissipation method of the minicomputer. [0003] As a key component of serve...

AI Technical Summary

Problems solved by technology

[0004] The memory liquid cooling module in the prior art is directly fixed on the memory, and the liquid cooling module must be removed when maintaining the memory, which is inconvenient for maintenance, and when the liquid cooling module is removed, there is a greater risk of coolant leakage

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