Micro-nano dual-mode detection processing module

A micro-nano and electric displacement technology, applied in the direction of nanotechnology, microstructure technology, microstructure device, etc., can solve the problems of processing system motion precision, workpiece installation, adjustment precision, cutting precision and difficult machining requirements of cutting tools, and achieve low cost and simple structure , Improve the effect of lateral stiffness

Active Publication Date: 2019-10-11
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the motion accuracy of the existing processing system, the adjustment accuracy of the workpiece installation, and the cutting accuracy of the tool are difficult to meet the above processing requirements.

Method used

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  • Micro-nano dual-mode detection processing module
  • Micro-nano dual-mode detection processing module
  • Micro-nano dual-mode detection processing module

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Embodiment Construction

[0032] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings, but it is not limited thereto. Any modification or equivalent replacement of the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention should be covered by the present invention. within the scope of protection.

[0033] The invention discloses a micro-nano dual-mode detection and processing module, such as figure 1 As shown, the module includes a Z-direction piezoelectric displacement table 1, a bracket 2, a capacitive displacement sensor 3, a capacitor fixing seat 4, an adjusting seat 5, a locking support 6, an upper fixing ring 7, a PZT vibrator 8, Lower fixing ring 9, test screw 10, flexible hinge 11, stop ring 12, fixing nut 13 and probe 14, wherein:

[0034] The capacitive displacement sensor 3 passes through the second set screw 17 ( Figure 11 ) is fixe...

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Abstract

The invention discloses a micro-nano dual-mode detection processing module. The module comprises a Z-direction piezoelectric displacement table, a support, a capacitive displacement sensor, a capacitor fixing seat, an adjusting seat, a locking support, an upper fixing ring, a PZT vibration exciter, a lower fixing ring, a test screw, a flexible hinge, a baffle ring, a fixing nut and a probe; the capacitive displacement sensor is fixed on the capacitor fixing seat; the capacitor fixing seat is fixed above the adjusting seat; the upper fixing ring, the PZT vibration exciter, the lower fixing ring, the test screw, the flexible hinge, the baffle ring, the fixing nut and the probe are sequentially fixed below the adjusting seat; the probe is fixed on the flexible hinge through a fixing nut and atest screw; the adjusting seat is fixed on the locking support; the locking support is fixed on the bracket; and the bracket is fixed on the Z-direction piezoelectric displacement table. The module has online detection and servo machining functions, and compared with commercial AFM, the module has larger machining size and wider material application range.

Description

technical field [0001] The invention relates to a micro-nano dual-mode detection and processing module. Background technique [0002] The development and application of MEMS and NEMS has promoted technological innovation in the field of micro-nano. At present, the mainstream micro-nano processing technology includes optical and electron beam exposure, focused ion beam processing, LIGA, etc., but due to the single processing material, complex and expensive equipment, the technology is difficult Breakthroughs have limited the development of the domestic micro-nano industry. Although the traditional "macro" mechanical manufacturing technology cannot meet the needs of micro-nano processing, the breakthrough of piezoelectric ceramics and sensor technology has made "micro" mechanical manufacturing possible, and the processing materials of "micro" mechanical manufacturing are not limited, and the processing structure is also Not limited to two-dimensional and quasi-three-dimension...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C99/00B82Y40/00
CPCB81C99/0005B82Y40/00
Inventor 闫永达史文博耿延泉胡振江王桐常顺宇
Owner HARBIN INST OF TECH
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