Photoelectric integrated packaging structure based on low temperature co-fired ceramics

Abstract

The invention discloses a photoelectric integrated packaging structure based on a low-temperature co-fired ceramic. The photoelectric integrated packaging structure comprises a multifunctional low-temperature co-fired ceramic substrate (3), a backlight detector chip array (2) and a laser chip array (1). The multifunctional low-temperature co-fired ceramic substrate (3) at least comprises a high-frequency functional layer (32) used for transmitting high-frequency signals and a direct-current functional layer (31) used for transmitting direct-current signals (31) from bottom to top; the backlight detector chip array (2) comprises N backlight detector chips; and the laser chip array (1) comprises N laser chips. According to the photoelectric integrated packaging structure based on the low-temperature co-fired ceramic, a plurality of functional layers are laminated integrally through a low-temperature co-fired ceramic technology to form the low-temperature co-fired ceramic substrate, and a three-dimensional circuit diagram is formed in the substrate through a via hole structure; signal transmission is achieved; and the photoelectric integrated packaging structure has the characteristics of high reliability, high integration level, small size and the like, and is suitable for integrated packaging of large-scale high-density array chips.

Description

technical field [0001] The invention belongs to the field of optoelectronic / microelectronic devices, and more specifically relates to an optoelectronic integrated packaging structure based on low temperature co-fired ceramics (Low Temperature Co-fired Ceramic, LTCC). Background technique [0002] For high-speed laser chips, their normal operation needs to be loaded with DC signals and high-frequency signals at the same time. At the same time, in order to facilitate adjustment, it is often necessary to separate the DC path and the high frequency path. [0003] In array integration, the traditional ceramic thin film circuit can only be designed in a single layer, so when designing a slot structure or a via hole, it can only penetrate the entire board, and it is impossible to design a non-penetrating special-shaped structure; for a double-layer structure , can only be supported by pads between layers. Obviously, the reliability of this method is relatively low, the volume incr...

AI Technical Summary

Problems solved by technology

[0003] In array integration, the traditional ceramic thin film circuit can only be designed in a single layer, so when designing a slot structure or a via hole, it can only penetrate the entire board, and it is impossible to design a non-penetrating special-shaped structure; for a double-layer structure , can only be supported by pads between layers. Obviously, the reliability of this method is relatively low, the volume increases, and special-shaped design cannot be carried out, which limits the improvement of integration.

If it is a structure with more than two layers, the traditional method is not competent, and the LTCC process can only be used for chemical molding preparation

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