Probe card, detecting device and wafer detecting method

Abstract

The invention provides a probe card, a detecting device and a wafer detecting method. The probe card comprises a circuit board with a hole with a conductive pattern, an image receiving component which is arranged on the first side of the circuit board, a probe assembly which is arranged on the second side of the circuit board, and an optical shaping element which is arranged on one side of the image receiving component. The probe assembly of the probe card electrically contacts a light source chip on a wafer to electrically turn on the light source chip. Through the image receiving component and the optical shaping element, optical performance detection of the light source chip can be realized. According to the invention, detection and quality screening of the light source chip can be realized at the wafer level; optical performance detection and electrical performance detection are simultaneously carried out on the light source chip; the detection efficiency is improved; and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of microelectronic testing, in particular to a probe card, a detection device and a wafer detection method. Background technique [0002] Traditionally, the packaged light source module is inspected. At this time, the light source module has integrated the light source chip and the corresponding optical components, etc., and the quality screening of the packaged light source module is carried out. When the optical performance of the light source module is detected Or when the electrical performance does not meet the testing standards, the unqualified is the light source module including the light source chip and optical components, that is, the scrapped light source chip and optical components instead of just the light source chip, and the cost of testing is high. In addition, in the traditional way It is difficult to simultaneously perform optical performance testing and electrical performance testing on the light so...

AI Technical Summary

Problems solved by technology

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a probe card, a detection device and a wafer detection method, which are used to solve the problem of high detection cost and the difficulty in optically performing simultaneous optical processing on the light source chip in the prior art. Performance testing and electrical performance testing issues

Images