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Two-component condensation-type thermal-conductive silicone gel and preparation method thereof

A condensed, thermally conductive silicon technology, used in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problem of unstable silicone gel performance, production, transportation and storage hazards, and the mixing ratio is prone to fluctuations, etc. question

Pending Publication Date: 2019-09-17
浙江励德有机硅材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the silicone gel products on the market are two-component addition type, which contains A component and B component, and the mixing ratio is 1:1 by mass; Platinum catalysts are easily poisoned to organic compounds containing N, P, S, and compounds containing heavy metal ions such as Sn, Ph, Hg, Bi, As, etc., and have certain limitations on the selection of coupling agents, so they cannot be used in some occasions
The mixing ratio of component A and component B of the condensation type silicone gel is 10:1 by mass. The measurement accuracy of the equipment is high, and the mixing ratio is prone to fluctuations, and the quality of the two components cannot be accurately matched, which leads to unstable performance of the silicone gel, and even non-curing phenomenon; moreover, component B is mostly flammable liquid, which poses a greater risk to production, transportation and storage

Method used

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  • Two-component condensation-type thermal-conductive silicone gel and preparation method thereof
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  • Two-component condensation-type thermal-conductive silicone gel and preparation method thereof

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preparation example Construction

[0053] The present invention also provides a method for preparing a two-component condensation type thermally conductive silicone gel, comprising the following steps:

[0054] Preparation of component A:

[0055] In parts by weight, stir 35-60 parts of α, ω-dihydroxy polydimethylsiloxane and 40-60 parts of silicon micropowder at 100-150°C, keep the vacuum at 0.05-0.15MPa, and rotate 200~500r / min, stirring for 30~80min;

[0056] Lower the temperature of the material to below 50°C, add 0.5 to 5 parts of zinc-containing compounds, and stir in vacuum for 5 to 20 minutes;

[0057] Add 0.03-0.1 parts of catalyst, and stir in vacuum for 10-30 minutes to obtain component A.

[0058] B component preparation:

[0059] In parts by weight, stir 30-55 parts of alkoxy-terminated polydimethylsiloxane and 40-60 parts of silicon micropowder at 100-150 °C, keep the vacuum at 0.05-0.15 MPa, and rotate at a speed of 200~500r / min, stirring for 30~80min;

[0060] Lower the temperature of the m...

Embodiment 1

[0078]

[0079] Prepare component A and component B respectively according to the dosage of each raw material in the above table;

[0080] Preparation of component A:

[0081] Put α, ω-dihydroxypolydimethylsiloxane and silicon micropowder into a high-speed disperser, heat to 110°C, keep the vacuum at 0.095MPa, rotate at 300r / min, and stir for 60min;

[0082] Lower the temperature of the material to below 50°C, add the zinc-containing compound, and stir in vacuum for 10 minutes;

[0083] Add the catalyst and stir in vacuum for 20min to obtain component A.

[0084] B component preparation:

[0085] Put alkoxy-terminated polydimethylsiloxane and silicon micropowder into a high-speed disperser, heat to 110°C, keep the vacuum at 0.095MPa, rotate at 300r / min, and stir for 60min;

[0086] Lower the temperature of the material to below 50°C, add a crosslinking agent, and stir in vacuum for 10 minutes;

[0087] Add coupling agent and stir in vacuum for 20min to obtain component ...

Embodiment 2

[0090]

[0091] According to the preparation method in Example 1, using the ratio of raw materials in this example, the silica gel was prepared.

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Abstract

The invention provides two-component condensation-type thermal-conductive silicone gel and a preparation method thereof. The silicone gel comprises an A component and a B components; the A component comprises the following raw materials, in parts by weight: 35-60 parts of alpha,omega-dihydroxy polydimethylsiloxane, 40-60 parts of silicon micropowder, 0.5-5 parts of a zinc-containing compound, and 0.03-0.1 part of a catalyst; and the B component comprises the following raw materials, in parts by weight: 30-55 parts of alkoxy-terminated polydimethylsiloxane, 40-60 parts of silicon micropowder, 2-10 parts of a cross-linking agent, and 1-5 parts of a coupling agent. According to the silicone gel provided by the invention, the zinc-containing compound is used in the formula, so that deep curing of the silicone gel is realized, and has better comprehensive performance than gel prepared by adding water, precipitated white carbon and glycerol organic phosphate; and the thermal conductive silicone gel has not high requirements for measurement accuracy of mixing equipment and simple and convenient operation during use, the stable performance of the silica gel after being mixed is ensured, and the thermal conductive silicone gel is suitable for continuous mass production in an automatic line.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a two-component condensation type heat-conducting silicon gel and a preparation method thereof. Background technique [0002] Silicone gel is a solid-liquid coexisting frozen material with low crosslinking density. It has the advantages of high flexibility, strong adhesion, good impact absorption, and very small internal stress. It is widely used in electronic appliances, Medical, sensor, automotive and other fields. [0003] According to the curing mechanism of silicone gel, it can be divided into two types: condensation silicone gel and addition silicone gel. At present, most of the silicone gel products on the market are two-component addition type, which contains A component and B component, and the mixing ratio is 1:1 by mass; Platinum catalysts are easily poisoned to organic compounds containing N, P, S, and compounds containing heavy metal ions such...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J11/04C09J11/06
CPCC08K2003/168C08K2003/2296C08L2205/025C09J11/04C09J11/06C09J183/04C08L83/04C08K3/36C08K3/22C08K5/544C08K5/5435C08K3/26C08K3/16
Inventor 王轲赵轶王振波金红君吴克李培杰宋丹丹
Owner 浙江励德有机硅材料有限公司
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