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Phenyl vinyl siloxane resin, high-refractive-index light-emitting diode (LED) packaging silicon resin composition and preparation method of silicon resin composition

A technology of phenylvinylsiloxane and tetramethyldivinyldisiloxane, which is applied in the field of electronic packaging, can solve the problems of easy yellowing of materials and affect the brittleness of polysiloxane, and achieves easy post-processing, Improved curing effect, high refractive index effect

Active Publication Date: 2019-09-13
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increase of phenyl content will affect the brittleness of polysiloxane and make the material more prone to yellowing

Method used

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  • Phenyl vinyl siloxane resin, high-refractive-index light-emitting diode (LED) packaging silicon resin composition and preparation method of silicon resin composition
  • Phenyl vinyl siloxane resin, high-refractive-index light-emitting diode (LED) packaging silicon resin composition and preparation method of silicon resin composition
  • Phenyl vinyl siloxane resin, high-refractive-index light-emitting diode (LED) packaging silicon resin composition and preparation method of silicon resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] This embodiment provides a phenyl vinyl siloxane resin, the preparation method of which is as follows.

[0093] Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane and place in a round bottom flask Toluene is added to prepare a mixed solution with a monomer mass ratio of 50%, and 0.1 g of trifluoromethanesulfonic acid is added dropwise to make the solution acidic. At 40°C, pure water with the same molar ratio as the reactive functional group was slowly added dropwise within 3 hours to carry out the hydrolysis reaction, and hydrolysis was carried out for 1 hour after the addition was completed. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55°C, add 0.1% potassium hydroxide to adjust the pH, carry out the condensation reaction at 150°C for 2h, transf...

Embodiment 2

[0097] This embodiment provides a phenyl vinyl siloxane resin, the preparation method of which is as follows.

[0098] Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane and place in a round bottom flask Toluene is added to prepare a mixed solution with a monomer mass ratio of 50%, and 0.1 g of trifluoromethanesulfonic acid is added dropwise to make the solution acidic. At 40°C, pure water with the same molar ratio as the reactive functional group was slowly added dropwise within 3 hours to carry out the hydrolysis reaction, and hydrolysis was carried out for 1 hour after the addition was completed. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55°C, add 0.1% potassium hydroxide to adjust the pH, carry out condensation reaction at 150°C for 0.5h, transfer...

Embodiment 3

[0100] This embodiment provides a phenyl vinyl siloxane resin, the preparation method of which is as follows.

[0101] Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane and place in a round bottom flask Toluene is added to prepare a mixed solution with a monomer mass ratio of 50%, and 0.1 g of trifluoromethanesulfonic acid is added dropwise to make the solution acidic. At 40°C, pure water with the same molar ratio as the reactive functional group was slowly added dropwise within 3 hours to carry out the hydrolysis reaction, and hydrolysis was carried out for 1 hour after the addition was completed. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55°C, add 0.1% potassium hydroxide to adjust the pH, carry out the condensation reaction at 150°C for 5h, transf...

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Abstract

The invention relates to phenyl vinyl siloxane resin, a high-refractive-index light-emitting diode (LED) packaging silicon resin composition and a preparation method of the silicon resin composition.The phenyl vinyl siloxane resin is prepared by the following steps: S1, mixing monomers, and adding an organic solvent to obtain a mixed solution, and adding a hydrolysis catalyst; S2, dropwise addingwater at 0-60 DEG C for a hydrolysis reaction, carrying out washing and suction filtration, adding an alkali catalyst to carry out a condensation reaction at a temperature of 120-160 DEG C, and carrying out washing and suction filtration to obtain the phenyl vinyl siloxane resin. The phenyl vinyl siloxane resin provided by the invention is high in refractive index and excellent in flexibility andyellowing resistance. When being used for preparing the LED packaging silicon resin, the phenyl vinyl siloxane resin has high refractive index, excellent tensile strength, excellent bonding strength,excellent light transmittance and excellent yellowing resistance, wherein partial performance reaches or is higher than the level of foreign similar imported products, and basic requirements of LED packaging can be met. A packaged surface-mounted LED device has excellent air tightness.

Description

Technical field [0001] The invention belongs to the technical field of electronic packaging, and specifically relates to a phenyl vinyl siloxane resin, a high refractive index LED packaging silicone resin composition and a preparation method thereof. Background technique [0002] A light emitting diode (Light Emitting Diode, hereinafter referred to as LED) is a semiconductor element that can directly convert electrical energy into light energy. Compared with incandescent or fluorescent lighting, it has the advantages of energy saving, low consumption, long life, environmental protection, controllable color, and small size. It is expected to replace traditional light sources as a new generation of lighting sources. The packaging materials used in LED lighting equipment are mainly epoxy resin and silicone resin. Compared with epoxy resin, silicone has many advantages: such as excellent UV resistance, weather resistance, thermal stability, high light transmittance, high refractive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/20C08L83/07C08L83/05C08L87/00
CPCC08G77/20C08L83/04C08L2205/025C08L2205/03C08L2203/206C08L87/00
Inventor 容敏智张泽平章明秋
Owner SUN YAT SEN UNIV
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