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Laser cutting device

A technology of laser cutting and cutting mechanism, applied in glass cutting devices, glass manufacturing equipment, manufacturing tools, etc., can solve problems such as increasing cost, reducing yield, increasing manufacturing process, etc., to achieve uniform thermal stress, improve yield, and avoid broken cracked effect

Active Publication Date: 2019-09-06
SHENZHENSHI YUZHAN PRECISION TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned cut glass workpieces are prone to edge chipping, and the edge strength of the glass workpiece is weak, and subsequent CNC cutting processing is required, which increases the process and increases the cost.
At the same time, glass cutting equipment that uses lasers to process glass workpieces has complex processes and fragments are prone to occur during the slitting process, which reduces the processing yield

Method used

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  • Laser cutting device
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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] It should be noted that when an element or component is considered to be “connected” to another element or component, it may be directly connected to the other element or component or there may be an intervening element or component at the same time. When an element or component is referred to as being "disposed on" another element or component, it can be directly disposed on the other element or component or intervening elements or compone...

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Abstract

The invention provides a laser cutting device. The laser cutting device comprises a machine table, a conveying mechanism, a cutting mechanism and a splitting mechanism, the cutting mechanism comprisesa moving platform and a laser cutter, the moving platform is used for storing workpieces and driving the workpieces to move according to a preset route, the laser cutter is used for emitting a laserbeam to pre-cut the workpieces on the moving platform and form a pre-cutting line, the laser cutting device further comprises a standing mechanism, the standing mechanism comprises a fixing frame, a carrier plate and two clamping assemblies, every clamping assembly comprises a clamping member and at least one clamping driving member, every clamping driving member is arranged on the carrier plate and adjacent to one side edge of the carrier plate, the clamping members are arranged on the clamping driving members and move under the driving of the corresponding clamping driving members to resistthe workpieces to in order to clamp and fix the workpieces and stand the workpieces for a preset time, and the splitting mechanism heats the stood workpieces along the pre-cut line to make the workpieces split along the pre-cut ling in order to realize the cutting of the workpieces.

Description

technical field [0001] The invention relates to a cutting device, in particular to a laser cutting device for cutting glass workpieces. Background technique [0002] Existing glass cutting equipment mainly adopts traditional glass cutters to cut workpieces. However, the above-mentioned cut glass workpiece is prone to edge chipping, and the edge strength of the glass workpiece is weak, and subsequent CNC cutting processing is required, which increases the manufacturing process and increases the cost. At the same time, glass cutting equipment that uses lasers to process glass workpieces is complex and prone to fragmentation during the slitting process, which reduces the processing yield. Contents of the invention [0003] In view of the above situation, it is necessary to provide a laser cutting device that can realize automation and has high cutting yield. [0004] A laser cutting device is used for processing workpieces. The laser cutting device includes a machine table,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/02C03B33/033
CPCC03B33/0222C03B33/033
Inventor 杨关伟王有德张红岩丁培
Owner SHENZHENSHI YUZHAN PRECISION TECH CO LTD
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