Epoxy resin/ordered boron nitride composite material and preparation method thereof

A technology of epoxy resin and composite materials, which is applied in the field of composite materials to achieve the effect of simple and gentle preparation method and high thermal conductivity

Active Publication Date: 2019-08-23
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
View PDF15 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for this kind of filler material with thermal conductivity anisotropy, its in-plane thermal conductivity is often much higher than its out-of-plane thermal conductivity, so simply and roughly distributing boron nitride fillers in the polymer system to a great extent Limits the improvement of thermal conductivity of polymer composites

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin/ordered boron nitride composite material and preparation method thereof
  • Epoxy resin/ordered boron nitride composite material and preparation method thereof
  • Epoxy resin/ordered boron nitride composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0060] Such as image 3 As shown, the specific embodiment part of the present invention also provides a method for preparing the above-mentioned epoxy resin / ordered boron nitride composite material, the method comprising the following steps:

[0061] Step S1: adding boron nitride, curing agent and catalyst into the epoxy resin, stirring and mixing evenly to obtain a boron nitride-epoxy resin mixture;

[0062] Step S2: transfer the boron nitride-epoxy resin mixture obtained in step S1 to a clean copper foil surface, align and cover it with another copper foil, and place the obtained mixture / copper foil system flatly in a pair of steel plates;

[0063] Step S3: putting the mixture / copper foil system obtained in step S2 into a hot press for hot pressing;

[0064] Step S4: transfer the hot-pressed mixture / copper foil system obtained in step S3 to an oven, heat and solidify, and perform shape cutting and copper stripping to obtain an epoxy resin / ordered boron nitride composite mat...

Embodiment 1

[0067] A preparation method of epoxy resin / ordered boron nitride composite material, said method comprising the following steps:

[0068] (1) Add 2g of boron nitride with a size of 2μm, 0.5g of methyl hexahydrophthalic anhydride and 0.05g of N,N-dimethylbenzylamine into 10g of epoxy resin, and mix by ball milling at 200rpm for 1h to obtain boron nitride- epoxy resin mixture;

[0069] (2) Transfer the boron nitride-epoxy resin mixture system of step (1) to a clean copper foil surface, align and cover it with another copper foil, and place the obtained mixture / copper foil system flatly in a pair of steel plates;

[0070] (3) Put the system in step (2) into a hot press, and perform hot pressing at 7MPa and 120°C;

[0071] (4) Transfer the hot-pressed mixture / copper foil system obtained in step (3) to an oven, heat and solidify, and obtain an epoxy resin / ordered boron nitride composite material after cutting and stripping copper, and then heat it at 140°C , 160° C., and 210° C. ...

Embodiment 2

[0074] A preparation method of epoxy resin / ordered boron nitride composite material, said method comprising the following steps:

[0075] (1) Add 4g of boron nitride with a size of 10μm, 1.5g of methyl hexahydrophthalic anhydride and 0.15g of N,N-dimethylbenzylamine into 10g of epoxy resin, and stir evenly at 300rpm for 1h to obtain boron nitride- epoxy resin mixture;

[0076] (2) Transfer the boron nitride-epoxy resin mixture system of step (1) to a clean copper foil surface, align and cover it with another copper foil, and place the obtained mixture / copper foil system flatly in a pair of steel plates;

[0077] (3) Put the system in step (2) into a hot press, and perform hot pressing at 10MPa and 150°C;

[0078] (4) Transfer the hot-pressed mixture / copper foil system obtained in step (3) to an oven, heat and solidify, and obtain an epoxy resin / ordered boron nitride composite material after cutting and stripping copper, and then heat it at 140°C , 160° C., and 210° C. for 2 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
Login to view more

Abstract

The invention provides an epoxy resin / ordered boron nitride composite material and a preparation method thereof. The composite material comprises the following components by mass: 5%-60% of boron nitride; 30%-80% of epoxy resin; 5%-30% of a curing agent; and 0.1%-10% of a catalyst. Specifically, by adjusting the hot-pressing technological parameters, boron nitride microchips form in-plane directional arrangement in the epoxy resin matrix. The composite material has excellent in-plane orientation, thereby acquiring good heat conductivity coefficient; the preparation method of the epoxy resin / boron nitride composite material is simple and mild, and can be used for large-scale industrial production.

Description

technical field [0001] The invention belongs to the field of composite materials, and relates to an epoxy resin / ordered boron nitride composite material and a preparation method thereof. Background technique [0002] As the development of electronic devices continues to be miniaturized, integrated, and intelligent, the "Moore's Law" in the semiconductor industry is gradually failing, and the effective heat dissipation of electronic devices has attracted more and more attention. The continuous accumulation of heat and the inability to dissipate it in time will bring many serious consequences, such as affecting the stability of electronic devices, continuous life and even explosion, so the timely discharge and dissipation of heat has become more and more restrictive to the semiconductor electronic packaging industry. Key technical issues for development. In order to develop new electronic cooling materials with high thermal conductivity, adding high thermal conductivity fille...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/38
CPCC08K3/38C08K2003/385C08L63/00
Inventor 孙蓉胡建滔曾小亮黄云孙佳佳许建斌汪正平
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap