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Laser (VCSEL) packaging structure

A packaging structure and laser technology, applied in the field of lasers, can solve the problems of increased driving loop inductance, difference in rising edge of laser optical pulse, etc., and achieve the effect of reducing loop inductance, fast rising edge of optical optical pulse, and realizing power output.

Pending Publication Date: 2019-08-16
杭州晟创激光科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

At present, most VCSEL lasers are packaged in a single-chip modular package or a series package of the same type of chips, such as VCSELs that emit light from the N-side or VCSELs that emit light from the P-side, and these packaging forms will lead to electrodes. The increase of package bonding wires increases the inductance of the drive loop, which leads to the difference in the rising edge of the laser pulse

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  • Laser (VCSEL) packaging structure
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Embodiment Construction

[0019] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The following description of the embodiments by referring to the accompanying drawings is exemplary, and is only used to explain the present invention, and should not be understood as a limitation to the present invention.

[0020] Such as figure 1 As shown, the laser module is composed of an N-side light-emitting VCSEL laser chip 2, a P-side light-emitting VCSEL chip 3, a gold wire connection line 4, a ceramic drive circuit substrate 1, and a homogenizing sheet 5.

[0021] In the embodiment of the present invention, such as image 3 As shown, the N-side light-emitting chip 2 and the P-side light-emitting chip 3 are encapsulated in series through a gold wire connection 4 to form a sub-module, and then multi...

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Abstract

The invention discloses a low-inductance and high-electro-optical-conversion-efficiency vertical cavity surface emitting laser (VCSEL) packaging structure. An N surface light emitting VCSEL laser chipand a P surface light emitting VCSEL chip are packaged in series to reduce packaging leads between electrodes, reduce inductance of the loop and raise the rising edge of the optical pulse. The laserresistance is increased by using the form of series packaging so that the laser chip obtains more voltage drop in the driving loop, correspondingly the voltage drop of other electronic components in the driving loop is reduced and the power consumption of other electronic components is reduced. Furthermore, the loop inductance can be further reduced and the rising edge of the laser optical pulse signal can be raised by parallel connection of two groups of the laser series packaging structures.

Description

Technical field [0001] The invention relates to a vertical cavity surface emitting laser (VCSEL) packaging structure with low inductance and high electro-optical conversion efficiency, belonging to the laser field. Background technique [0002] Lidar is more and more widely used in the fields of unmanned driving, AGV car, intelligent security, obstacle avoidance, etc. The present invention mainly solves the problem of low inductance, high conversion efficiency VCSEL laser packaging. At present, most VCSEL lasers adopt single-chip modular packaging or series packaging of the same type of chips, such as VCSELs with N-side light emission or VCSELs with P-side light emission, and these packaging forms will cause the gap between the electrodes. The increase of the package bonding wire leads to the increase of the inductance of the drive loop, which results in a poor rising edge of the laser light pulse. The invention reduces the package bonding wire between the electrodes by connecti...

Claims

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Application Information

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IPC IPC(8): H01S5/183H01S5/062H01S5/042H01S5/024
CPCH01S5/02469H01S5/042H01S5/06216H01S5/183
Inventor 董武
Owner 杭州晟创激光科技有限公司
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