Semiconductor chip pickup device with adjusting and positioning functions

Abstract

The invention relates to a semiconductor chip pickup device with adjusting and positioning functions, including a moving plate, a processor, an air guide chamber, a suction pipe, a suction cup and a sensing mechanism. The air guide chamber is internally provided with an adsorption mechanism. The suction pipe is internally provided with a positioning mechanism. The air guide mechanism includes a fan, an adjusting rod, an adjusting assembly, a vent plate and a number of adjusting blocks. The positioning mechanism includes a cylinder, a first motor, a rotating shaft and two positioning assemblies. Each positioning assembly includes a contraction unit, a rotating rod, a side rod and a distance sensor. According to the semiconductor chip pickup device with adjusting and positioning functions, the relative positions of a chip and the suction cup can be determined through the positioning mechanism, so that the suction cup is located right above the chip after position adjustment by the movingplate, and the chip can be easily sucked up. Moreover, the compression degree of springs is detected by the sensing mechanism, so that the adsorption mechanism can change the relative positions of the adjusting blocks and through holes to adjust the adsorption force of the suction cup, and the chip is avoided being damaged by long-time excessive extrusion. The practicability of the equipment is improved.

Description

technical field [0001] The invention relates to the field of chip pick-up equipment, in particular to a semiconductor chip pick-up device with adjustment and positioning functions. Background technique [0002] Integrated Circuit (Integrated Circuit, IC), also known as microchip, chip or chip, is a way of miniaturizing circuits (including semiconductor devices, including passive components, etc.) in electronics, and is often manufactured on semiconductor wafers surface. [0003] With the development of the semiconductor industry, the thickness of the integrated circuit chip is getting thinner and the size of the chip is becoming more and more diverse. In the process of chip production and processing, chip picking is often required. In the existing chip pick-up device, the suction force of the straw is fixed. When picking up different types of chips, the suction force may be too heavy or too small due to the weight of the chip. When the suction force is too strong, it is eas...

AI Technical Summary

Problems solved by technology

In the existing chip pick-up device, the suction force of the straw is fixed. When picking up different types of chips, the suction force may be too heavy or too small due to the weight of the chip. When the suction force is too strong, it is easy to squeeze the chip too much. When the suction is too weak, it is not enough to absorb the suction cup. Not only that, but the existing chip picking device lacks the function of positioning the chip. When picking up the chip, the suction tube may deviate from the top of the chip, resulting in poor chip picking effect. better, which in turn reduces the practicality of existing chip pickers

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