Hot-melt pressure sensitive adhesive film and preparation method thereof

Abstract

The embodiment of the invention discloses a hot-melt pressure sensitive adhesive film. The raw materials of the hot-melt pressure sensitive adhesive film include, by weight, 25-35 parts of a resin, 30-40 parts of a rubber, 1-3 parts of a vulcanized rubber composition, 3-10 parts of a promoter, 25-35 parts of a filler and 1-5 parts of a crosslinking agent. The raw materials undergo open milling andmixing by an open mill, and the obtained mixture is cast to obtain the hot-melt pressure sensitive adhesive film. The promoter is at least one or a mixture of 2,4,6-tris(dimethylaminomethyl)phenol,triethylamine, triethanolamine, benzyldimethylamine, a bicyclic amidine curing agent, 2-dimethylaminomethylphenol, pyridine and a quaternary ammonium salt promoter. The hot-melt pressure sensitive adhesive film of the invention has the advantages of high curing speed, excellent storage stability, high curing strength, good temperature resistance, environmental protection during preparation, and low cost.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of adhesive films, in particular to a hot-melt pressure-sensitive adhesive film and a preparation method thereof. Background technique [0002] The adhesive film is usually slightly viscous or non-sticky at room temperature, and melts or cross-links and solidifies under heat and pressure to bond the adherend. According to different raw materials and uses, there are many types of existing adhesive films, some have poor flexibility, poor low temperature resistance, some have long curing time, some have poor storage stability, some have glue overflow after curing, some have high cost, and some have high cost. It is well known that the current adhesive film has been coated by hot melt method, but the current system is basically an epoxy system plus a curing agent / crosslinking agent. In this case, the storage stability of the adhesive film is seriously affected. 6 months, which limits...

AI Technical Summary

Problems solved by technology

According to different raw materials and uses, there are many types of existing adhesive films, some have poor flexibility, poor low temperature resistance, some have long curing time, some have poor storage stability, some have glue overflow after curing, some have high cost, and some have high cost. It is well known that the current adhesive film has been coated by hot melt method, but the current system is basically an epoxy system plus a curing agent / crosslinking agent. In this case, the storage stability of the adhesive film is seriously affected. 6 months, which limits the customer's use cycle, and the performance of product batches fluctuates greatly