PCB components and manufacturing method thereof

Abstract

The invention provides a PCB (printed Circuit Board) component and a manufacturing method thereof, belonging to the field of printed circuit boards. The method comprises the following steps of: creating a principle element symbol of a target component according to the target bonding pad and the target heat dissipation hole of the target component, wherein the principle element symbol comprises thefollowing components: a first pin corresponding to the target bonding pad and a second pin corresponding to the target heat dissipation hole; creating a physical packaging diagram of the target component according to the physical parameters of the target bonding pad and the physical parameters of the target heat dissipation hole, wherein the physical packaging diagram comprises a region of a first pin corresponding to physical parameters of the target bonding pad and a region of a second pin corresponding to the physical parameters of the target heat dissipation hole and arranged in the region of the first pin; manufacturing the PCB substrate of the target component according to the principle component symbol and the physical packaging diagram; and welding the target pin and the target bonding pad on the PCB substrate to obtain the PCB comprising the target component. The method can unify the specifications of the heat dissipation holes and is beneficial to heat dissipation of the PCBcomponents.

Description

technical field [0001] The present application relates to the field of printed circuit boards, in particular to a PCB component and a manufacturing method thereof. Background technique [0002] In the PCB (Printed Circuit Board, printed circuit board), high-power components are soldered to the PCB substrate through pins and pads, and the components mainly dissipate heat through the copper skin or pads on the surface of the PCB substrate. However, as the requirements for product integration become higher and higher, the size of PCBs and components is getting smaller and smaller, and the copper skin or pad area on the surface of the PCB substrate is also reduced accordingly, which makes components through copper skin or soldering The heat dissipation effect of the disk is poor. The heat dissipation effect of the components can be improved by drilling holes on the pads of the PCB substrate opposite to the components, but different designers tend to miss holes and less holes, w...

AI Technical Summary

Problems solved by technology

However, as the requirements for product integration become higher and higher, the size of PCBs and components is getting smaller and smaller, and the copper skin or pad area on the surface of the PCB substrate is also reduced accordingly, which makes components through copper skin or soldering The heat dissipation effect of the disk is poor

The heat dissipation effect of components can be improved by drilling holes on the pads opposite to the PCB substrate and components, but different designers tend to miss holes and less holes, which cannot guarantee the heat dissipation effect of components

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