Flame-retardant epoxy resin

Abstract

The invention discloses flame retardant epoxy resin. The epoxy resin comprises the following raw material components in parts by weight: 10-20 parts of a cyclic hydrocarbon compound, 10-15 parts of aflame retardant and curing compound, 60-65 parts of an epoxy resin monomer, 10-15 parts of a flame retardant microcapsule, 8-10 parts of modified phenolic resin, 0.5-1 part of expanded graphite, 3-5 parts of a curing agent, 1.5-4.5 parts of talcum powder, 2-5 parts of quartz sand, 0.5-1 part of a defoaming agent and 0.2-1.5 parts of a leveling agent. The flame retardant microcapsule contains a halogen-free flame retardant, the halogen-free flame retardant is an inorganic flame retardant, and the halogen-free flame retardant contains more than 40% of aluminum hydroxide Al (OH) 3, has flame retardant, smoke abatement and filling three functions, and can generate synergistic flame retardant effect with various substances. The flame retardant microcapsule is a pollution-free inorganic flame retardant, the epoxy resin contains flame retardant and curing compounds, the flame retardant and curing compounds contain the phenolic resin, and an important application of the phenolic resin is as abinder. The phenolic resin can be used as abrasive tools and refractory materials, can provide required mechanical strength, heat resistance and electrical properties for the epoxy resin after crosslinking.

Description

technical field [0001] The invention relates to a flame-retardant epoxy resin, in particular to a flame-retardant epoxy resin. Background technique [0002] Epoxy resins generally refer to organic compounds containing two or more epoxy groups in their molecules. All polymer compounds containing epoxy groups in their molecular structures are collectively referred to as epoxy resins. Except for a few, their relative molecules The quality is not high. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain. The epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can cross-link with various types of curing agents to form an insoluble polymer epoxy resin with a three-way network structure, which has excellent electrical and mechanical properties. Performance and chemical corrosion resistance are widely used in coatings, civil engineer...

AI Technical Summary

Problems solved by technology

Due to the active epoxy groups in the molecular structure, they can cross-link with various types of curing agents to form an insoluble polymer epoxy resin with a three-way network structure, which has excellent electrical and mechanical properties. Performance and chemical corrosion resistance are widely used in coatings, civil engineering, and electronics, but due to the poor thermal properties of epoxy resins, its application range is limited. Therefore, it is necessary to prepare epoxy resins with excellent thermal properties and high flame retardant properties. Resin becomes the focus of research

[0003] Existing epoxy resins use halogens to flame-retardant, but halogens will produce toxic gases during combustion, causing harm to the human body, and the flame retardancy is poor