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Polyimide precursor solution, method for producing porous polyimide film, and porous polyimide film

A polyimide precursor, polyimide film technology, applied in the direction of coating, can solve the problems of low dispersibility, low substrate peelability, pinhole generation, etc., to achieve excellent dispersibility and improved peelability Effect

Active Publication Date: 2019-08-02
FUJIFILM BUSINESS INNOVATION CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

), when the above-mentioned polyimide precursor solution is coated on the base material to form a porous polyimide film, there is a high adhesiveness between the obtained porous polyimide film and the base material, thereby from the base material When the detachability is low
When the peelability is low, when the porous polyimide film is peeled off from the substrate, the porous polyimide film may be broken
In addition, when the dispersibility of the resin particles is low, pinholes may be generated in the obtained porous polyimide film

Method used

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  • Polyimide precursor solution, method for producing porous polyimide film, and porous polyimide film
  • Polyimide precursor solution, method for producing porous polyimide film, and porous polyimide film
  • Polyimide precursor solution, method for producing porous polyimide film, and porous polyimide film

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Embodiment

[0306] Examples are described below, but the present invention is not limited to these Examples. In addition, in the following description, unless otherwise specified, "part" and "%" are all based on mass.

[0307] [Preparation of inorganic particle dispersion]

[0308] As the inorganic particle dispersion liquid, the following silica particle dispersion liquid was prepared.

[0309] Silica particle dispersion (1): volume particle diameter 5nm solid content 20% by mass

[0310] Silica particle dispersion (2): volume particle diameter 13nm solid content 30% by mass

[0311] Silica particle dispersion (3): volume particle diameter 65nm solid content 40% by mass

[0312] Silica particle dispersion (4): volume particle diameter 210nm solid content 40% by mass

[0313] Silica particle dispersion (5): volume particle diameter 450 nm solid content 40% by mass

[0314] Silica particle dispersion (6): volume particle diameter 150 nm solid content 40% by mass

[0315] Titanium oxi...

Embodiment 2～18

[0337] In addition to changing the type and amount of the resin particle dispersion and the type and amount of the silica particle dispersion according to Table 2, resin particles and inorganic particle-dispersed polyimide precursor solutions (PAA- 2) ~ (PAA-18). The particle size distribution was measured for the resin particle and inorganic particle dispersion polyimide precursor solution of each example by the method already mentioned. The results are summarized in Table 2.

Embodiment 19

[0346] [Production of porous polyimide film (PIF-1)]

[0347] First, an aluminum substrate (hereinafter referred to as an aluminum substrate) for forming a coating film of a resin particle and an inorganic particle-dispersed polyimide precursor solution was prepared. The surface of the aluminum substrate was washed with toluene and used.

[0348] Next, resin particles and inorganic particle-dispersed polyimide precursor solution (PAA-1) were coated on the aluminum substrate so that the film thickness after drying was about 30 μm to form a coating film, and dried at 90° C. for 1 hour. Then, the temperature was raised from room temperature (25°C, the same below) to 400°C at a rate of 10°C / min, kept at 400°C for 1 hour, and then cooled to room temperature to obtain a porous polyimide film with a film thickness of about 25 μm. (PIF-1).

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PUM

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Abstract

A polyimide precursor solution includes an aqueous solution that contains water; a resin particle that does not dissolve in the aqueous solution; inorganic particles that have a volume average particle diameter within a range of 0.001 mu m to 0.2 mu m; and a polyimide precursor.

Description

technical field [0001] The invention relates to a polyimide precursor solution, a method for manufacturing a porous polyimide film and the porous polyimide film. Background technique [0002] A polyimide resin is a material having properties excellent in mechanical strength, chemical stability, and heat resistance, and a porous polyimide film having these properties has attracted attention. [0003] For example, Patent Document 1 describes a method for producing a separator for a lithium secondary battery: calcining a close-packed body of monodispersed spherical inorganic particles to form a sintered body of inorganic particles, After filling the polyamic acid, it is calcined to form a polyimide resin, and then immersed in a solution that dissolves the inorganic particles but does not dissolve the resin, and dissolves and removes the inorganic particles. [0004] Patent Document 2 describes an organic porous body having pores made of polyimide and an ion conductor in which ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K3/36C08J5/18C08L79/08
CPCC08G73/1007C08G73/1067C08K3/36C08J5/18C08J2379/08C08L79/08C08J9/0061C08J2205/044C08J9/0066C08J9/26C08J9/008C09D179/08C08J2201/046C08J2201/0462C08J2425/06C08J2433/06C08J2423/06
Inventor 额田克己佐佐木知也广瀬英一
Owner FUJIFILM BUSINESS INNOVATION CORP
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