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Electroconductive adhesive film and preparation method thereof

A technology of conductive adhesive film and adhesive film, which is applied in the direction of conductive adhesives, adhesives, films/sheets without carriers, etc., can solve the problems of poor heat resistance and low mechanical strength of conductive adhesive films, and achieve improved electrical conductivity. Effect of improving electron-withdrawing performance and reducing steric hindrance

Inactive Publication Date: 2019-07-16
陈琪峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a conductive adhesive film and its preparation method for the current problems of poor heat resistance and low mechanical strength of the conductive adhesive film

Method used

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  • Electroconductive adhesive film and preparation method thereof

Examples

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Effect test

preparation example Construction

[0021] The preparation method of heat-resistant active agent is:

[0022] (1) Take phenyltrichlorosilane and add toluene at a mass ratio of 2~5:5~10, stir and mix for 50~60min, then add deionized water 1~3 times the mass of toluene dropwise, and control the dropping time for 60~90min. Stir and mix at 20~25°C for 2~4h, let stand for 30~50min, take the upper layer, wash with saturated saline and deionized water, and dry over anhydrous magnesium sulfate to obtain a dried product, which is obtained by mass ratio of 3~5 : 5~10: 0.01~0.05 Add toluene and catalyst, stir and mix at 70~80°C for 18~24h, filter with suction, take the filter cake, wash it with ether, dry it, and obtain the dried product a;

[0023] (2) Take the dry product a, add aluminum trichloride and dichloromethane according to the mass ratio of 3~5:10~15:70~80, pass through nitrogen protection, stir and mix at 0~4°C for 30~60min to obtain the mixture, Take 4-methylbenzenesulfonyl chloride and add it to the mixture ...

Embodiment 1

[0031] The catalyst is: take tetrabutylammonium hydroxide and add methanol to mix at a mass ratio of 1:10.

[0032] The preparation method of heat-resistant active agent is:

[0033] (1) Take phenyltrichlorosilane and add toluene at a mass ratio of 5:10, stir and mix for 60 minutes, then dropwise add deionized water 3 times the mass of toluene, control the dropping time for 90 minutes, stir and mix at 25°C for 4 hours, and let stand for 50 minutes , take the upper layer, wash with saturated brine and deionized water, and dry over anhydrous magnesium sulfate to obtain a dry product. Take the dry product and add toluene and catalyst at a mass ratio of 3:5:0.01, stir and mix at 80°C for 24 hours, and filter with suction , take the filter cake, wash it with ether, and dry it to obtain the dried product a;

[0034] (2) Take the dry product a, add aluminum trichloride and dichloromethane at a mass ratio of 5:15:80, pass through nitrogen protection, stir and mix at 4°C for 60 minute...

Embodiment 2

[0042] The catalyst is: take tetrabutylammonium hydroxide and add methanol at a mass ratio of 3:20 to mix.

[0043] The preparation method of heat-resistant active agent is:

[0044] (1) Take phenyltrichlorosilane and add toluene at a mass ratio of 2:5, stir and mix for 50 minutes, then dropwise add deionized water with 1 times the mass of toluene, control the dropping time for 60 minutes, stir and mix at 20°C for 2 hours, and let stand for 30 minutes , take the upper layer, wash with saturated brine and deionized water, and dry over anhydrous magnesium sulfate to obtain a dry product. Take the dry product and add toluene and catalyst at a mass ratio of 5:10:0.05, stir and mix at 70°C for 18 hours, and filter with suction , take the filter cake, wash it with ether, and dry it to obtain the dried product a;

[0045] (2) Take the dry product a, add aluminum trichloride and dichloromethane at a mass ratio of 3:10:70, pass through nitrogen protection, and stir and mix at 0°C for ...

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Abstract

The invention discloses an electroconductive adhesive film and a preparation method thereof, and belongs to the field of microelectronic package connecting materials. According to the electroconductive adhesive film and method provided by the invention, a heat-resistant active agent prepared by the method improves the mechanical properties of the adhesive film structure, improves the thermal stability of the adhesive film, maintains a better morphological structure of the adhesive film during the electrical conduction and heating process, and improves the conductivity; an electroconductive additive prepared by the method enhances the conductivity of the adhesive film, reduces a volume effect of the adhesive film in the electrical conductive process, increases cycle stability of the material and improves electrical conduction stability; an adhesive film active agent prepared by the method enhances mechanical strength of an electrolyte in the electrical conduction process of the electroconductive film and improves bonding of interfaces; and in the electrical conduction process, a proton circulation channel is opened, a high-electroconductive adhesive film is formed, finally a plasticizing active agent and a dispersing active agent are added to improve the plasticity, toughness and mechanical properties of the adhesive film, and the components are uniformly dispersed in the adhesive film by utilizing the dispersing active agent to improve the conductivity. The electroconductive adhesive film and method provided by the invention solve the problems of poor heat resistance and low mechanical strength of a current electroconductive adhesive film.

Description

technical field [0001] The invention relates to a technology in the field of microelectronic packaging connection materials, in particular to a conductive adhesive film and a preparation method thereof. Background technique [0002] With the development of the electronics industry, electronic assembly is becoming more and more miniaturized and high-density. Many conductive connections no longer rely on traditional methods such as welding or plugging, but are realized through conductive adhesive films. Conductive adhesive film is a compound formed by dispersing conductive particles in an adhesive insulating resin, which is used for bonding components and cured under heat and pressure, so as to realize the functions of electrification and bonding. Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J9/02C09J163/10C09J11/04C09J11/06C09J11/08
CPCC08K2003/023C08K2003/164C08K2201/011C08L2205/03C09J9/02C09J11/04C09J11/06C09J11/08C09J163/10C09J2203/326C09J7/10C09J2301/314C08L29/04C08L71/02C08K13/06C08K9/10C08K3/02C08K3/16C08K5/45C08K5/1535
Inventor 陈琪峰
Owner 陈琪峰
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