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Apparatus for inspecting substrate and method thereof

A substrate inspection and substrate technology, which is applied to measurement devices, optical devices, instruments, etc., can solve the problems of difficulty in realizing OCT miniaturization and thickness measurement errors, and achieve the effect of shortening the time required for measurement and reducing measurement errors.

Active Publication Date: 2019-07-05
株式会社高迎科技
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the thickness inspection of the coating film is performed using OCT, the saturation phenomenon of light occurs due to the reflection of the reference mirror, and errors in thickness measurement occur.
In addition, it is difficult to miniaturize the OCT due to the components such as the reference mirror, the window glass, and the beam splitter of the OCT.

Method used

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  • Apparatus for inspecting substrate and method thereof
  • Apparatus for inspecting substrate and method thereof
  • Apparatus for inspecting substrate and method thereof

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Embodiment Construction

[0039] Various embodiments described herein are given for the purpose of clearly explaining the technical idea of ​​the present disclosure, and are not intended to be limited to specific embodiments. The technical idea of ​​the present disclosure includes various modifications (modifications), equivalents (equivalents), alternatives (alternatives) of the embodiments described herein, and embodiments in which all or a part of the embodiments are selectively combined. In addition, the scope of rights of the technical thought of this disclosure is not limited to the various examples presented below or the specific description thereof.

[0040] Including technical or scientific terms, as long as they are not defined differently, the terms used herein may have the meanings generally understood by those of ordinary skill in the art to which the present disclosure belongs.

[0041] Expressions such as "comprising", "may include", "have", "may have", "has", "may have" etc. as used her...

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PUM

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Abstract

The disclosure provides a substrate inspection apparatus. The substrate inspection apparatus according to the present disclosure may include: a light source configured to radiate laser light onto a coated film that is spread on a region of a substrate; a light detector configured to obtain optical interference data caused by an interference between reference light, that is generated by the laser light being reflected from a surface of the coated film, and measurement light, that is generated by the laser light penetrating the coated film and being scattered; and a processor configured to derive a thickness of the coated film corresponding to the region, based on the optical interference data.

Description

technical field [0001] The present disclosure relates to a substrate inspection device and a substrate inspection method. Background technique [0002] In the processing process of the substrate, the substrate may be coated in order to protect components on the substrate. Such coatings may be referred to as conformal coatings. In order to confirm whether the coating film on the substrate generated by coating is uniformly coated to a predetermined thickness, a thickness inspection of the conformal coating film may be performed. [0003] For the thickness inspection of the coating film, a two-dimensional (2Dimensional) fluorescent photographic inspection can be performed. However, the two-dimensional image shooting inspection can only perform a qualitative inspection of the thickness of the coating film, and cannot measure the accurate thickness value of the coating film. In addition, when the coating film is thin (for example: about 30 μm) in the two-dimensional imaging in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06
CPCG01B11/0675G01B11/0658G01B11/0625G01B11/0683
Inventor 洪映周洪德和金玟奎崔桢熏
Owner 株式会社高迎科技
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