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Substrate inspection device and substrate inspection method

一种基板检查、基板的技术，应用在测量装置、采用光学装置、仪器等方向，能够解决准确的测量妨碍等问题，达到缩短时间的效果

Active Publication Date: 2021-05-28
GAOYING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the measurement based on OCT, there are restrictions on improving the resolution in the depth direction and the measurement depth range. In the electrode part of the element on the substrate, saturation (saturation) phenomenon occurs due to the light used in OCT, which hinders accurate measurement.

Method used

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  • Substrate inspection device and substrate inspection method
  • Substrate inspection device and substrate inspection method
  • Substrate inspection device and substrate inspection method

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Embodiment Construction

[0040] Various embodiments described herein are given for the purpose of clearly explaining the technical idea of ​​the present disclosure, and are not intended to be limited to specific embodiments. The technical idea of ​​the present disclosure includes various modifications (modifications), equivalents (equivalents), alternatives (alternatives) of the embodiments described herein, and embodiments in which all or a part of the embodiments are selectively combined. In addition, the scope of rights of the technical idea of ​​the present disclosure is not limited to the various embodiments presented below or their specific descriptions.

[0041] Including technical or scientific terms, as long as they are not defined differently, the terms used herein may have the meanings generally understood by those of ordinary skill in the art to which the present disclosure belongs.

[0042] Expressions such as "comprising", "may include", "have", "may have", "has", "may have" etc. as used...

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Abstract

The substrate inspection apparatus of the present disclosure may include: a first light source that irradiates ultraviolet rays toward a coating film of a substrate mixed with a fluorescent dye; a first photosensor that captures fluorescence generated from the coating film irradiated from the ultraviolet rays and obtaining a two-dimensional image of the substrate; a processor that derives one of a plurality of regions of the substrate based on the two-dimensional image; a second light source that irradiates laser light toward the one region; and a second light a sensor that obtains light interference data occurring from the one area by means of the laser light; the processor can derive a thickness of the coating film with respect to the one area based on the light interference data.

Description

technical field [0001] The present disclosure relates to a substrate inspection device and a substrate inspection method. Background technique [0002] In the processing process of the substrate, the substrate may be coated in order to protect components on the substrate. Such coatings may be referred to as conformal coatings. In order to confirm whether the coating film on the substrate generated by coating is uniformly coated to a predetermined thickness, a thickness inspection of the conformal coating film may be performed. [0003] For the thickness inspection of the coating film, a two-dimensional (2Dimensional) photographic inspection can be performed. The two-dimensional photographic examination is used to obtain a two-dimensional image about the subject body and examine the subject body, and may include a two-dimensional fluorescent photographic examination. However, the two-dimensional photo shooting inspection can only perform a qualitative inspection of the thi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/06
CPCG01B11/0675G01B11/0658G01B11/0625G01B11/0683
Inventor 洪映周洪德和金玟奎崔桢熏
Owner GAOYING TECH CO LTD
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