Pneumatic and stable semiconductor wafer cutting device based on the principle of magnetic pole boosting

Abstract

The invention discloses a pneumatic and stable semiconductor wafer cutting device based on the principle of magnetic pole pressurization. In the middle of the surface of the base, the top and rear ends of the fixed base are provided with a gantry guide frame, and the bottom of the mobile platform is installed on the upper end of the gantry guide frame by means of snapping. The cutter of the present invention ensures the angle of the gravity cooler through the weight box, and the gas is pressurized and output by the rotary pressure plate, and the bottom of the cutting piece is aerated, so as to solve the problem that the chip raw material is cooled during the cutting process. The problem of water peeling, and the water cooling head is designed to be cooled on both sides, which effectively avoids the situation that the chip raw material is washed away by the cooling liquid, and improves the integrity of the wafer after cutting.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an aerodynamically stable semiconductor wafer cutting device based on the principle of magnetic pole boosting. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called wafer. Wafer is the basic material for manufacturing semiconductor chips. During manufacture, silicon crystals are obtained through a long process of growing After cutting, rolling, slicing, chamfering, polishing, and laser engraving, the silicon wafer and the board are separated to become the chip raw material of the integrated circuit factory. There are such problems in the use of existing wafer cutting devices on the market: [0003] The current technology separates the chip raw material on the silicon crystal board from the board body through horizontal cutting, so as to carry out extraction. Since...

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Problems solved by technology

[0003] The current technology separates the chip raw material on the silicon crystal board from the board body through horizontal cutting, so as to carry out extraction. Since the cooling liquid is generally used to directly cool the cutting point to achieve the cooling of the cutting sheet, the chip raw material after cutting is Coolant flushed away, wafer integrity after dicing is limited and needs to be optimized

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