3D packaging structure based multifunctional phased array TR chip
A three-dimensional packaging and multi-functional technology, applied in the field of multi-functional phased array TR chips, can solve the problems of poor consistency, high cost, and a lot of debugging work, so as to reduce the size and weight, avoid installation and debugging, and waste manpower and material resources. Effect
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] The specific embodiment of the present invention will be described in detail below in conjunction with accompanying drawing, as figure 1Shown is a structural diagram of a multifunctional phased array TR chip based on a three-dimensional packaging structure. The radio frequency chip includes four identical single channels, namely the first channel CH1, the second channel CH2, the third channel CH3 and the fourth channel CH4 , the four single...
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