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Method for surface treatment of wireless charging flexible circuit boards

A flexible circuit board and surface treatment technology, applied in the secondary treatment of printed circuits, coating of non-metallic protective layers, etc. High production efficiency, improving whitening and discoloration, and improving product quality

Inactive Publication Date: 2019-06-04
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the copper surface cannot be effectively treated, poor quality problems such as whitening and discoloration of the gold surface of the pad, missing plating, exposed copper and nickel are likely to occur after chemical immersion gold

Method used

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  • Method for surface treatment of wireless charging flexible circuit boards
  • Method for surface treatment of wireless charging flexible circuit boards
  • Method for surface treatment of wireless charging flexible circuit boards

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Embodiment Construction

[0023] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, and the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. To explain the present invention, but not as a limitation of the present invention.

[0024] Such as Figure 1 to Figure 2 Shown, a kind of wireless charging flexible circuit board surface treatment method, comprises the following steps:

[0025] Step 1: Paste a layer of micro-mucosa on the flexible circuit board before immersion gold treatment on the flexible circuit board;

[0026] Step 2: Open the window on the pad position of the flexible circuit board. The position and size of the window opening of the micro-mucosa are consistent with the window opening of the cover film; the micro-mucosa can effectively avoid the direct impact of the brush on the cover film when grinding the board, and also It can effective...

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Abstract

The invention discloses a method for surface treatment of wireless charging flexible circuit boards, which comprises the following steps: a slightly sticky film is pasted on each flexible circuit board before gold depositing treatment of the flexible circuit boards; S2, windows are opened at the positions of the pads of the flexible circuit boards, wherein the positions and sizes of the windows ofthe slightly sticky film are the same with those of the windows of a covering film; S3, the flexible circuit boards are treated by plasma and grinding; S4m the slightly sticky films on the flexible circuit boards are torn open, and the flexible circuit boards are sandblasted; S5, gold depositing treatment is carried out on the flexible circuit boards, two flexible circuit boards are placed on each grid of a hanging basket, and the flexible circuit boards are placed in an activation cylinder for gold deposition in a way in which the back is exposed relative to the pad surface; and S6, the flexible circuit boards are taken out, and whether the flexible circuit boards are good or bad is checked. The method of the invention can improve the quality of products, has high production efficiency,and is suitable for mass production.

Description

technical field [0001] The invention relates to the technical field of FPC flexible printed circuit boards, in particular to a surface treatment method for wireless charging flexible circuit boards. Background technique [0002] As wireless charging technology becomes more and more mature, competition in the smartphone wireless charger market is increasing. At present, the production of the main coil on the mobile phone wireless charger in the market is generally based on the FPC circuit design method, which is a coil-shaped precision circuit. This FPC wireless charging coil is made of a double-sided thick copper substrate (one-sided copper thickness is about 60 μm) equipped with an ultra-thin cover film (PI thickness is about 7 μm, glue thickness is about 5 μm). Due to the special structure of this product, the press cover film is generally pressed by means of pressure transmission, which requires more filling auxiliary materials. After high temperature pressing, it is eas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
Inventor 卢书远梁冲刘超梁凯
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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