Vacuum circuit chip packaging mould

Abstract

The invention discloses a vacuum circuit chip packaging mould. The vacuum circuit chip packaging mould is characterized in that the vacuum circuit chip packaging mould comprises a lower mould(1) and an upper mould (2), the lower mould (1) comprises a plurality of platforms (3) and a mold cavity (4), wherein the platforms are horizontally arranged at intervals, the mold cavity (4) is used for placing electron components, feeding grooves (5) and residual material discharging grooves (6) are correspondingly formed in the two ends of the platforms (3) and the mold cavity (4), feeding holes (7) areformed in the connecting ends of the mold cavity (4) and the feeding grooves (5), and discharging holes (8) are formed in the connecting ends of the mold cavity (4) and the residual material discharging grooves (6); and vacuum holes (10) are formed in the bottom ends of the residual material discharging grooves (6), and the vacuum holes (10) are connected with a vacuum pump (11). According to thevacuum circuit chip packaging mould, the degassing effect is great, and the vacuum circuit chip packaging mould is particularly suitable for degassing and packaging of packaging materials with largestickiness and bad mobility.

Description

technical field [0001] The invention relates to a vacuum circuit chip packaging mold, which belongs to the technical field of circuit chip packaging. Background technique [0002] Circuit chip packaging is to install the integrated circuit built-in chip for external use, which plays a role in placing, fixing and sealing, protecting the integrated circuit built-in chip, and enhancing the ability to adapt to the environment. Existing electronic packaging molds generally have an upper mold and a lower mold that are used in conjunction with each other, and since the contact surfaces of the upper mold and the lower mold are relatively smooth planes, it is difficult to control the installation position of the upper mold and the lower mold when they are installed. , repeated adjustments are required to achieve precise installation of the upper and lower dies. [0003] In addition, the existing electronic packaging molds generally do not have a degassing device. Even if a few packa...

AI Technical Summary

Problems solved by technology

Existing electronic packaging molds generally have an upper mold and a lower mold that are used in conjunction with each other, and since the contact surfaces of the upper mold and the lower mold are relatively smooth planes, it is difficult to control the installation position of the upper mold and the lower mold when they are installed. , repeated adjustments are required to achieve precise installation of the upper and lower dies

[0003] In addition, the existing electronic packaging molds generally do not have a degassing device. Even if a few packaging molds have a degassing function, they generally rely on the flow of the packaging material itself to exhaust. air bubbles, thereby affecting the packaging quality; and the flow mode of the packaging material injected into the existing electronic packaging mold, only relying on the continuous injection of liquid packaging material in the feed trough to push the packaging material into the cavity and the remaining material discharge chute , especially for packaging materials with relatively high viscosity, it is very unfavorable for the uniform filling of the packaging material in the cavity, and it is also extremely unfavorable for the exhaust of the packaging material with high viscosity

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