Multifunctional communication circuit board test device

A testing device and circuit board technology, applied in electronic circuit testing, measuring device housing, printed circuit testing, etc., can solve the problems of reduced testing efficiency, poor stability of the testing mechanism, complicated steps, etc., so as to improve testing efficiency and ensure stability. , the effect of improving accuracy

Active Publication Date: 2019-04-30
安徽米兰电子科技有限公司
View PDF9 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic products in the direction of miniaturization, multi-function, portability and high performance, circuit boards, which are the main components of electronic products, are also evolving in the direction of high density, multi-layer and fine pitch, which constitutes a significant impact on the circuit board manufacturing industry. If the defective products cannot be screened out in time during the manufacturing process, it will inevitably increase the scrap rate of the product, which will increase the cost of the downstream process
Therefore, it is necessary to improve the testing technology and adopt appropriate testing methods to improve product testing efficiency. The existing circuit board testing device has certain deficiencies in the process of use, and the circuit board cannot be replaced well, and the steps are relatively complicated. , the test efficiency is relatively low, and it is believed that it will be further improved in the future to meet the different needs of use and thus be more widely used;
[0003] The existing circuit board testing device has certain disadvantages in the process of use. It cannot test multiple circuit boards at the same time, and the replacement of circuit boards is more complicated, which greatly reduces the test efficiency. It cannot test different types of circuit boards. For testing, the applicability is not strong, the circuit board cannot be well fixed in multiple directions, and the overall stability of the testing mechanism is poor, which affects the testing accuracy

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multifunctional communication circuit board test device
  • Multifunctional communication circuit board test device
  • Multifunctional communication circuit board test device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] Such as Figure 1-5 As shown, a multifunctional communication circuit board testing device includes a device frame assembly 1, a top plate 2 is installed on the top of the device frame assembly 1, and an electric box 3 is installed on the bottom of the device frame assembly 1. A test platform 4 is installed on the upper end of the box 3, and two groups of slide bars 7 are arranged in parallel on the surface of the upper end of the test platform 4, and a left load plate 5 an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a multifunctional communication circuit board test device. The test device includes a device frame assembly, wherein a top portion of the device frame assembly is equipped witha top board, a bottom portion of the device frame assembly is equipped with an electric box, an upper end of the electric box is equipped with a test platform, an upper surface of the test platform is parallelly provided with two sets of sliding rods, the two sets of sliding rods are respectively equipped with a left bearing board and a right bearing board in a sliding mode, upper ends of the left bearing board and the right bearing board are respectively provided with a circuit board, and the middle near a back end between the top board and the test platform is equipped with a supporting sliding board. The test device is advantaged in that circuit boards of various models can be tested in functions, strong adaptability is realized, two sets of circuit boards are simultaneously tested, workers are convenient to replace the circuit boards, test efficiency is improved, transverse and vertical fixing of the circuit boards can be realized, integral stability can be guaranteed, and test accuracy is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board testing, and in particular relates to a testing device, in particular to a multifunctional communication circuit board testing device. Background technique [0002] With the development of electronic products in the direction of miniaturization, multi-function, portability and high performance, circuit boards, which are the main components of electronic products, are also evolving in the direction of high density, multi-layer and fine pitch, which constitutes a significant impact on the circuit board manufacturing industry. If the defective products cannot be screened out in time during the manufacturing process, it will inevitably increase the scrap rate of the product, which will increase the cost of the downstream process. Therefore, it is necessary to improve the testing technology and adopt appropriate testing methods to improve product testing efficiency. The existing circuit board tes...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/04
CPCG01R31/2808
Inventor 聂润华
Owner 安徽米兰电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products