Granularly-separable ceramic substrate and separation method thereof

Abstract

The invention discloses a granularly-separable ceramic substrate. The granularly-separable ceramic substrate comprises a substrate body, wherein the substrate body is provided with a circuit unit, andthe substrate body is provided with mutually communicated upper cutting grooves around the circuit unit, the upper cutting grooves are provided with filling lines made of a metal conductive material,and en external electrode connected with the filling lines and used for connecting with a power supply device is arranged on the substrate body; the circuit unit is arranged on one side of the substrate body, and lower cutting grooves corresponding to the upper cutting grooves are formed in the other side surface of the substrate body. A separation method based on the ceramic substrate is provided. The strength of the substrate body of the granularly-separable ceramic substrate in the production process can be effectively ensured, the ceramic substrate is easy to separate, and the quality ofthe ceramic substrate in the granular separation can be ensured.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a granular-separatable ceramic substrate and a separation method thereof. Background technique [0002] At present, in the semiconductor packaging industry, the separation method used for ceramic substrates is usually water jet or laser cutting, and the corresponding cutting equipment is complicated and expensive, which makes the production cost of packaging products high. [0003] Moreover, in actual production, pre-cutting is usually performed during the production of ceramic substrates, but the existence of cutting lines will reduce the strength of the ceramic substrate, making it prone to fragility during the production process; moreover, when the ceramic substrate is separated into For a single chip, no matter whether it is broken by hand or by a machine, it will cause a certain number of single products to be broken and have burrs, which makes th...

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Problems solved by technology

[0002] At present, in the semiconductor packaging industry, the separation method used for ceramic substrates is usually water jet or laser cutting, and the corresponding cutting equipment is complicated and expensive, which makes the production cost of packaging products high.

[0003] Moreover, in actual production, pre-cutting is usually performed during the production of ceramic substrates, but the existence of cutting lines will reduce the strength of the ceramic substrate, making it prone to fragility during the production process; moreover, when the ceramic substrate is separated into For a single piece, no matter whether it is broken by hand or by a machine, it will cause a certain number of single pieces to break and have burrs, making the production yield of the product low

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