Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which is applied in printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of unfavorable high-density circuit production and reduce the utilization rate of flexible circuit board typesetting, so as to increase the typesetting utilization rate and meet The effect of production requirements

Active Publication Date: 2021-11-16
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when making circuits, the holes on the flexible circuit board need to increase the hole ring to enhance its connection function, which reduces the utilization rate of the layout of the flexible circuit board, which is not conducive to the production of high-density circuits.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The following will be combined with Figure 1 to Figure 14 and an embodiment, the circuit board 100 provided by the technical solution and the manufacturing method thereof are further described in detail.

[0051] see Figure 1 to Figure 7 , the first embodiment of the present invention provides a method for manufacturing a circuit board 100, including the following steps:

[0052] For a first step, see figure 1 , providing a substrate 10 .

[0053] The substrate 10 is double-sided, and the substrate 10 includes a base layer 11 , a first bottom copper layer 12 and a second bottom copper layer 13 formed on opposite sides of the base layer 11 .

[0054] In this embodiment, the base layer 11 is a flexible resin layer, such as polyimide (PI), polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).

[0055] In the second step, see figure 2 , opening at least one connection hole 102 on the substrate 10 .

[0056] In this embodiment, the number of the connec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A circuit board, which includes a base layer and a conductive line, the base layer is provided with at least one communication hole penetrating through two opposite surfaces of the base layer, the conductive line includes the Two conductive circuit layers on two opposite surfaces, and a conductive column formed in the communication hole and electrically connecting the two conductive circuit layers, the diameter of the conductive column is smaller than the diameter of the communication hole.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof. Background technique [0002] At present, many flexible circuit boards will have high complexity, high precision, and high density wiring requirements. However, during circuit fabrication, holes on the flexible circuit board need to be increased with rings to enhance their connection function, which reduces the utilization rate of flexible circuit board layout and is not conducive to the production of high-density circuits. Contents of the invention [0003] In view of this, the present invention provides a method for manufacturing a circuit board that avoids the existence of an annular structure. [0004] Also provided is a circuit board that avoids the presence of the annular ring structure. [0005] A method for manufacturing a circuit board, comprising the steps of: [0006] A substrate is provided, the substrate includes a base layer, a first bottom copper layer and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42H05K1/11
CPCH05K1/115H05K3/425H05K2201/10416H05K2203/052H05K3/108H05K3/4647H05K3/4652H05K2201/0145H05K2201/0154H05K2201/0367H05K2201/09563H05K2203/308H05K3/182H05K1/189H05K3/287H05K3/0017H05K3/4661
Inventor 胡先钦李成佳
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com