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Magnetic control device of vacuum system and vacuum equipment

A technology of magnetic force control and vacuum system, applied in vacuum evaporation plating, ion implantation plating, metal material coating process, etc., can solve the problems of affecting the vacuum degree inside the cover, affecting the purity and uniformity of material deposition on the sample surface, etc.

Active Publication Date: 2019-04-12
CHENZHOU TEIKYO CHEM TECH
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a magnetic control device for a vacuum system to solve the problem in the prior art that the rotation of the sample needs to enter the vacuum cover through the connecting rod. When the mechanical arm is taken out, the vacuum degree inside the cover is affected, thereby Technical issues affecting the purity and uniformity of material deposition on the sample surface
[0007] The invention also provides a vacuum device to solve the problem in the prior art that the rotation of the sample needs to enter the vacuum cover through the connecting rod. When the mechanical arm is taken out, the vacuum degree inside the cover is affected, thereby affecting the material deposition on the surface of the sample. Technical issues of purity and homogeneity

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  • Magnetic control device of vacuum system and vacuum equipment
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  • Magnetic control device of vacuum system and vacuum equipment

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Embodiment Construction

[0040] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0041] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention provides a magnetic control device of a vacuum system and vacuum equipment, and relates to the technical field of vacuum control systems. The magnetic control device of the vacuum systemcomprises a cover body, a sample supporting magnetic suction assembly and a first magnetic suction assembly, and the first magnetic suction assembly is arranged at the exterior of the cover body andabsorbs the sample supporting magnetic suction assembly; and the first magnetic suction assembly drives the sample supporting magnetic suction assembly to rotate. The problem that the rotation of thesample needs to enter a vacuum cover through a connecting rod, and the vacuum degree in the cover body and the material deposition of the sample surface are affected is solved; and the sample supporting magnetic suction assembly is arranged in the cover body, the first magnetic suction assembly is arranged outside the cover body, the first magnetic suction assembly fixes the position of the samplesupporting magnetic suction assembly, the sample rotation is completed, and the purity and uniformity of the material deposition on the sample surface are ensured.

Description

technical field [0001] The invention relates to the technical field of vacuum control systems, in particular to a magnetic control device and vacuum equipment for a vacuum system. Background technique [0002] Vacuum coating machine refers to the equipment for coating substrates under high vacuum. Coating methods mainly include: vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition, etc.; commonly used are mainly evaporation and sputtering. [0003] The process of evaporative coating is: heating the target material, so that the surface components are evaporated in the form of atomic groups or ions, and settle on the surface of the substrate to form a thin film through the film forming process. [0004] In the above-mentioned prior art, in the process of using the evaporation coating, the material on the surface of the sample needs to be uniformly deposited. At this time, it is necessary to control the opening and closing o...

Claims

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Application Information

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IPC IPC(8): C23C14/50
CPCC23C14/505
Inventor 欧阳方平高宏军孔德明朱旭坤熊翔
Owner CHENZHOU TEIKYO CHEM TECH
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