A temperature prediction method and system for an aircraft-borne electronic device

Abstract

The invention discloses a temperature prediction method and system for an aircraft-borne electronic device. The method comprises the steps: acquiring the current flight state of the aircraft; Obtaining a random configuration network temperature prediction model corresponding to the flight state; Acquiring temperature associated data at the current moment corresponding to the flight state; Taking the temperature data of the current moment as the input of the random configuration network temperature prediction model, and performing predicting to obtain the temperature difference between the current moment and the next moment of the to-be-tested electronic equipment; And calculating the temperature of the to-be-tested electronic equipment at the next moment according to the temperature difference and the temperature of the to-be-tested electronic equipment at the current moment. The temperature prediction of the aircraft-borne electronic equipment is realized by adopting the random configuration network temperature prediction model, so that the prediction accuracy is improved, the calculation complexity is reduced, and the generalization capability is improved.

Description

technical field [0001] The invention relates to the technical field of temperature prediction of electronic equipment, in particular to a method and system for temperature prediction of aircraft-borne electronic equipment. Background technique [0002] With the rapid development of electronic technology, electronic components are increasingly miniaturized, but the power consumption is getting higher and higher. The increase in power consumption and the decrease in volume lead to a sharp increase in the heat flux of electronic equipment. These factors will lead to an increase in chip temperature. Therefore, failure caused by temperature has become an important reason for the failure of electronic equipment. The large amount of heat generated by electronic devices must be evacuated in time, and their thermal response during operation must also be taken seriously. Moreover, because the flight envelope experienced by the aircraft usually causes drastic changes in the air paramet...

AI Technical Summary

Problems solved by technology

The traditional thermal simulation method has the following defects: it is difficult to obtain accurate temperature response under complex flight conditions, which severely limits the prediction ability of the network model; it is necessary to analyze the detailed heat transfer relationship between each device node in depth and specifically, and model The process is complex; thermal parameters such as mass, specific heat capacity, and thermal power of the electronic equipment to be tested need to be limited, and the modeling conditions are strict; the calculation speed and accuracy need to be improved, and there are problems such as ambiguity when solving the coefficients of the heat balance equation ; Poor generalization ability

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