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Enhanced wave absorbing material structure body

A technology of wave-absorbing materials and structures, applied in the field of wave-absorbing materials, can solve the problems of poor heat dissipation performance of wave-absorbing materials and inability to take into account wave-absorbing performance, etc., achieve good heat dissipation effect, solve insufficient reflectivity, and good high power resistance sexual effect

Pending Publication Date: 2019-04-05
深圳唯创微波技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide an enhanced wave-absorbing material structure, which aims to solve the problems of poor heat dissipation performance of existing wave-absorbing materials, and the inability to take into account the wave-absorbing performance when improving heat dissipation performance, etc.

Method used

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  • Enhanced wave absorbing material structure body

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Effect test

Embodiment 1

[0061] An enhanced wave-absorbing material structure, the enhanced wave-absorbing material structure is such as figure 1 , 2 , 4, the heat dissipation bottom plate 1 is a copper bottom plate with a thickness of 2mm; the heat transfer body 2 is a copper cylinder (no need to coat a thin layer of copper), and its radius is 1mm; the first wave-absorbing material 3 is an EPP material, Its length and width are 320mm×320mm, and its thickness is 22mm; the carrier board 4 is a PCB substrate board, its thickness is 0.3mm, its thermal conductivity is 0.4w / (m·℃), and its dielectric constant is 4.4; the reflection enhancement layer 41 is copper The foil layer has a line width of 0.5 mm; the second absorbing material 5 is an EPP material with a length and width of 320 mm×320 mm and a thickness of 8 mm.

Embodiment 2

[0063] An enhanced wave-absorbing material structure, the enhanced wave-absorbing material structure is such as figure 1 , 2 , 4, the heat dissipation bottom plate 1 is a copper bottom plate with a thickness of 2mm; the heat transfer body 2 is a copper cylinder (no need to coat a thin layer of copper), and its radius is 1mm; the first wave-absorbing material 3 is an EPP material, Its length and width are 320mm×320mm, and its thickness is 16mm; the carrier board 4 is a PCB substrate board, its thickness is 0.3mm, its thermal conductivity is 0.4w / (m·℃), and its dielectric constant is 4.4; the reflection enhancing layer 41 is copper The foil layer has a line width of 0.25mm; the second absorbing material 5 is EPP material, its length and width are 320mm×320mm, and its thickness is 8mm.

Embodiment 3

[0065] An enhanced wave-absorbing material structure, the enhanced wave-absorbing material structure is such as figure 1 , 2 , 4, the heat dissipation bottom plate 1 is a copper bottom plate with a thickness of 2mm; the heat transfer body 2 is a copper cylinder (no need to coat a thin layer of copper), and its radius is 1mm; the first wave-absorbing material 3 is EPE material, Its length and width are 320mm×320mm, and its thickness is 16mm; the carrier board 4 is a PCB substrate board, its thickness is 0.3mm, its thermal conductivity is 0.4w / (m·℃), and its dielectric constant is 4.4; the reflection enhancing layer 41 is copper The foil layer has a line width of 0.5mm; the second absorbing material 5 is EPE material, its length and width are 320mm×320mm, and its thickness is 8mm.

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Abstract

The invention relates to the technical field of wave absorbing materials and particularly provides an enhanced wave absorbing material structure body. The enhanced wave absorbing material structure body is formed by periodically splicing a plurality of identical structural units, each of the structural units comprises a heat dissipating bottom plate, a first wave absorbing material stacked on theheat dissipating bottom plate, a carrier plate stacked on the surface of the first wave absorbing material, a plurality of heat transfer bodies which pass through the first wave absorbing material from the heat dissipating bottom plate and is in contact with the carrier contact, a reflection enhancement layer which is stacked on the surface of the carrier in a patterned way and is in contact withthe heat transfer bodies, and a second wave absorbing material which is stacked on the reflection enhancement layer and a surface of the carrier which is not covered by the reflection enhancement layer. The enhanced wave absorbing material structure body of the invention has good heat dissipating performance and good wave absorbing performance, and the problem that a flat wave absorbing material has insufficient reflectance at a low frequency is solved.

Description

technical field [0001] The invention belongs to the technical field of wave-absorbing materials, in particular to an enhanced wave-absorbing material structure. Background technique [0002] The absorbing material is a kind of energy conversion functional material. The working principle is to absorb the electromagnetic energy of the electromagnetic wave and mainly convert it into internal energy, which is dissipated in the form of heat. Therefore, the higher the absorbed power, the more heat it converts . The application of absorbing materials in microwave anechoic chambers, aerospace and other fields can absorb unwanted electromagnetic waves to prevent interference. With the advent of the 5G era, communication equipment is developing towards high frequency and high power. How to improve heat dissipation without affecting the performance of materials has become an urgent problem to be solved. [0003] The wave-absorbing materials currently used in the market mainly include...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q17/00
CPCH01Q17/00
Inventor 刘列于伟漆一宏张辉彬莫智广
Owner 深圳唯创微波技术有限公司
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