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Method for precise resistor trimming on flexible substrate by using ultrafast laser

A flexible substrate, ultrafast laser technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as thermal damage, weak bonding between the resistance layer and the substrate, and poor thermal conductivity, achieving broad application prospects and improving Accuracy, Avoiding Thermal Damage Effects

Inactive Publication Date: 2019-03-26
INNO LASER TECH CORP LTD +1
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  • Application Information

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Problems solved by technology

Its thermal conductivity is poor, and it is easy to cause thermal damage or thermal deformation when nanosecond laser trimming is used; (2) The resistance of flexible devices is generally prepared on a flexible substrate by low-temperature coating, and the combination of the resistance layer and the substrate is relatively weak , the temperature will easily cause the peeling of the resistance layer; (3) flexible devices will have higher requirements for the accuracy of resistance adjustment

Method used

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  • Method for precise resistor trimming on flexible substrate by using ultrafast laser
  • Method for precise resistor trimming on flexible substrate by using ultrafast laser
  • Method for precise resistor trimming on flexible substrate by using ultrafast laser

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Embodiment Construction

[0025] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0026] In a specific embodiment, a method for using ultrafast lasers to precisely adjust groups on a flexible substrate is disclosed, which includes the following processes in sequence:

[0027] to combine figure 2 Firstly, place the flexible substrate 2 on the support jig 1. A suitable jig must be used so that the flexible substrate 2 can be unfolded flat and will not move easily, or a vacuum honeycomb flat plate is used to support the flexible substrate, such as vacuum adsorption.

[0028] recombine image 3 , coating the precursor material of the resistance material on the flexible substrate 2 to form a wet film 3 . And specifically, printing or printing may be used to coat the precursor material on the flexible substrate 2 . And th...

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Abstract

The invention, which relates to the technical field of laser resistor trimming, discloses a method for precise resistor trimming on a flexible substrate by using ultrafast laser. Precise resistor trimming of a flexible circuit board is carried out by using ultrafast laser creatively; and the ultrafast laser material removing process is a cold treatment process, and only the material zone under theultrafast laser effect is removed but the surrounding material is not affected obviously. Meanwhile, the ultrafast laser has the short pulse. The resistor trimming by using the ultrafast laser has the following advantages: firstly, the resistor trimming precision is improved; secondly, the resistive material / structure is protected from being damaged; and thirdly, the thermal damage of the substrate is avoided. Moreover, since the existing flexible devices are made of flexible non-metallic materials that include glass or plastic materials and the like and have the thicknesses of more than tenor even tens of micrometers, the resistor trimming needs cold-processing ultrafast laser due to the high temperature sensitivity of the devices. Therefore, the method has broad application prospects.

Description

technical field [0001] The invention relates to the technical field of laser grouping, in particular to a method for precise grouping on a flexible substrate by using an ultrafast laser. Background technique [0002] In the prior art, laser modulation has been widely used in electronic devices. The principle is to use a focused laser beam to remove resistive materials to achieve change and modulation of device resistance. The feature of this technology is the non-contact material removal method, and the precise amount of material removed according to the spot size (as small as a few microns), so that the precise adjustment of resistance can be realized. A basic requirement in the process of adjusting the resistance is that the material removal process should not cause obvious damage to (1) the resistance material and (2) the substrate material. Nanosecond lasers can generally meet the resistance adjustment requirements of devices with general hard substrates. With the imp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/302H01L21/308
CPCH01L21/302H01L21/308
Inventor 张杰王晧智赵晓杰
Owner INNO LASER TECH CORP LTD
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