Chip pin correction tooling and chip installation method

Abstract

The invention discloses a chip pin correction tooling. Since a guiding hole array composed of the guiding holes corresponds to a lead column array composed of lead columns, the guiding holes are onlyslightly larger than the diameter of the lead columns, and the texture of the lead columns is soft, the lead columns can be slowly pressed into the guiding holes of the calibration tooling to adjust the spacing among the lead columns and the morphology of the lead columns, so as to make the spacing among the lead columns and the topography of the lead columns meet preset standards; therefore, accurate positioning between chip pins and a PCB surface bonding pad can be realized, the combination degree of a solder and the pins is improved, the solder joint strength is improved, and the solderingreliability is improved. The invention also provides a chip installation method. The spacing among the lead columns and the topography of the lead columns can be corrected through the correction tooling; therefore, the accurate positioning between the chip pins and the PCB surface bonding pad can be realized when soldering the chip to the surface of the PCB, the combination degree of the solder and the pins is improved, the solder joint strength is improved, and the soldering reliability is improved.

Description

technical field [0001] The invention relates to the technical field of electronic assembly, in particular to a chip pin calibration tool and a chip mounting method. Background technique [0002] In the assembly process of printed boards, especially in the assembly process of printed boards of aerospace products, due to the need for high reliability, chips with lead pins are usually used, such as CI-CGA (Ceramics Integration-Cone Grid Array ) packaged chip as the chip in the circuit board. Chips in CI-CGA package form have a series of advantages such as good thermal matching performance, strong resistance to mechanical vibration and high pin integration, and are widely used in high-reliability occasions. [0003] However, when installing a chip with lead pins, usually the pins of the chip and the pads on the surface of the PCB cannot be accurately positioned, resulting in poor bonding between the solder on the surface of the PCB and the pins of the western chip, resulting in...

AI Technical Summary

Problems solved by technology

[0003] However, when installing a chip with lead pins, usually the pins of the chip and the pads on the surface of the PCB cannot be accurately positioned, resulting in poor bonding between the solder on the surface of the PCB and the pins of the western chip, resulting in low solder joint strength. And other problems, affecting the reliability of welding

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