Miniature light emitting diode lamp panel, manufacturing method thereof, backlight module and display device

Abstract

The invention discloses a miniature light emitting diode lamp panel, a manufacturing method thereof, a backlight module and a display device. A thin film transistor array substrate is used to replacea PCB (Printed Circuit Board) in the prior art. The thin film transistor is characterized in that a large scale semiconductor integrated circuit is manufactured on a glass substrate, and film layers of a generation circuit are formed by sputtering, chemical vapor deposition and other processes, so that the manufacturing cost is lowered, and the etching accuracy is much higher than that of the PCB.During manufacturing of the lamp panel through combination of the thin film transistor array substrate and a miniature light emitting diode chip, the miniature light emitting diode chip is bonded with a current-conducting and heat-conducting adhesive, so that the chip with a poor light emitting effect can be replaced; maintenance of lamp panel is facilitated; and the difficulty of maintenance islowered.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a micro light-emitting diode lamp panel, a manufacturing method thereof, a backlight module and a display device. Background technique [0002] Mini-Light Emitting Diode (Mini LED for short) technology refers to LED technology with a light-emitting chip area size of 100-200 μm. Mini LED inherits the high efficiency, high brightness, high reliability, and fast response time of inorganic LEDs, and has the characteristics of self-illumination without backlight, and has the advantages of energy saving, simple mechanism, small size, and thin profile. It has the advantages of longer luminous life, higher brightness, better material stability, and no image burn-in. Applying it to the backlight module can realize multi-regional dimming of the display device to improve the performance of the display device. display effect. [0003] At present, the LED lamp board needs to solder the LED...

AI Technical Summary

Problems solved by technology

[0003] At present, the LED lamp board needs to solder the LED chip on the printed circuit board (PCB for short). The pad size is greatly reduced, resulting in increased etching difficulty

Moreover, after the soldering of the currently used LED light board is completed, if the LED chip is found to be faulty, it cannot be removed from the PCB board, making maintenance difficult and costly.

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