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Active ester resin and cured product thereof

A technology of active ester and resin, which is applied in the field of curable resin composition and active ester resin, can solve the problems of low dielectric constant, dielectric loss tangent, and unsatisfactory market requirements, and achieve low curing shrinkage and dielectric loss The effect of low tangent

Active Publication Date: 2019-03-01
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The active ester resin described in Patent Document 1 is characterized in that the dielectric constant and dielectric loss tangent of the cured product are lower than those using conventional curing agents such as phenol novolac resins, but it does not satisfy the current requirements. The market demand level, especially for the value of dielectric loss tangent, requires further reduction

Method used

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  • Active ester resin and cured product thereof
  • Active ester resin and cured product thereof
  • Active ester resin and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0156] The manufacture of embodiment 1 active ester resin (1)

[0157] In a flask equipped with a thermometer, a dropping funnel, a condenser, a fractionating tube, and an agitator, 433 parts by mass of 1-naphthol, 108 parts by mass of toluene, 99 parts by mass of dicyclopentadiene, and p-toluenesulfonic acid monohydrate 27 parts by mass. It heated up to 130 degreeC, stirring the content of the flask, and stirred at 130 degreeC for 2 hours, and made it react. After completion of the reaction, 12 parts by mass of a 49% sodium hydroxide aqueous solution was added for neutralization, 200 parts by mass of toluene was added, and 100 parts by mass of water was washed three times. Toluene and the like were distilled off under heating and reduced pressure to obtain 522 parts by mass of a mixture (1) containing unreacted 1-naphthol and polynaphthol resin (B-1). The hydroxyl equivalent weight of the obtained mixture (1) was 234 g / equivalent.

[0158] 141 parts by mass of isophthaloyl...

Embodiment 2

[0159] The manufacture of embodiment 2 active ester resin (2)

[0160] In a flask equipped with a thermometer, a dropping funnel, a condenser, a fractionating tube, and an agitator, 404 parts by mass of 1-naphthol, 500 parts by mass of toluene, 96 parts by mass of p-xylylenedimethanol, and p-toluenesulfonic acid monohydrate 6 parts by mass. It heated up to 120 degreeC, stirring the content of the flask, and stirred at 120 degreeC for 1 hour, and made it react. After completion of the reaction, 4 parts by mass of a 49% sodium hydroxide aqueous solution was added for neutralization, and then 400 parts by mass of toluene was added, followed by washing with 200 parts by mass of water three times. Toluene and the like were distilled off under heating and reduced pressure to obtain 448 parts by mass of a mixture (2) containing unreacted 1-naphthol and polynaphthol resin (B-2). The hydroxyl equivalent weight of the obtained mixture (2) was 170 g / equivalent.

[0161] 141 parts by m...

Embodiment 3

[0162] The manufacture of embodiment 3 active ester resins (3)

[0163] In a flask equipped with a thermometer, a dropping funnel, a condenser, a fractionating tube, and an agitator, 404 parts by mass of 1-naphthol, 560 parts by mass of toluene, 150 parts by mass of dimethylolbiphenyl, and one p-toluenesulfonic acid Hydrate 6 mass parts. It heated up to 120 degreeC, stirring the content of the flask, and stirred at 120 degreeC for 1 hour, and made it react. After completion of the reaction, 4 parts by mass of a 49% sodium hydroxide aqueous solution was added for neutralization, and then 400 parts by mass of toluene was added, followed by washing with 200 parts by mass of water three times. Toluene and the like were distilled off under heating and reduced pressure to obtain 510 parts by mass of a mixture (3) containing unreacted 1-naphthol and polynaphthol resin (B-3). The hydroxyl equivalent weight of the obtained mixture (3) was 189 g / equivalent.

[0164] 141 parts by mass...

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Abstract

Provided are: an active ester resin having low cure shrinkage and also having a low loss tangent in a cured product; a curable resin composition containing same; a cured product thereof; a printed wiring board; and a semiconductor sealing material. An active ester resin, a curable resin composition containing same, a cured product thereof, a printed wiring board, and a semiconductor sealing material, said active ester resin being characterized by having, as essential reactive raw materials thereof: (A) a phenolic hydroxyl group-containing compound; (B) a polynaphthol resin having a molecular structure whereby a naphthol compound (b) is nodular at a structural site ([alpha]) containing an aromatic ring or a cyclo ring; and (C) an aromatic polycarboxylic acid or an acid halide thereof.

Description

technical field [0001] The present invention relates to an active ester resin having a low curing shrinkage rate and a low dielectric loss tangent of a cured product, a curable resin composition containing the active ester resin, a cured product thereof, a printed circuit board, and a semiconductor sealing material. Background technique [0002] In the technical field of insulating materials used in semiconductors and multilayer printed circuit boards, various electronic components have become thinner, and signals have increased in speed and frequency. Development of new resin materials that meet these market trends is required. For example, along with thinning of electronic components, "warpage" of components due to heat has become prominent, and in order to suppress this warpage, resin materials with low cure shrinkage and high dimensional stability have been developed. In addition, in order to reduce energy loss due to heat generation and the like for high-speed and high-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/02C08G63/133H01L23/29H01L23/31H05K1/03
CPCC08G63/133C08L63/00C08G59/4223H01L23/293H05K1/0326C08G59/4276C08G63/916H01L23/31C08G59/02H05K1/03H01L23/29C08L67/02C08L2203/206
Inventor 佐藤泰冈本竜也河崎显人
Owner DIC CORP
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